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Miniaturized detection coil former for NMR spectroscopy
One exemplary miniaturized detection coil former for NMR spectroscopy includes a macroporous carrier material having a first surface and a second surface...
Semiconductor component with plastic housing, and process for producing
A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing;...
Method for fabricating metallic bit-line contacts
A memory cell and method of forming the same is provided. To make contact between a bit line and a select transistor of a dynamic memory unit on a semiconductor...
Thin film field effect transistor with gate dielectric made of organic
material and method for fabricating the same
The gate dielectric layer of a thin film field effect transistor is formed as a multilayer layer system having at least one self assembling molecular monolayer...
Method of producing a package for semiconductor chips
The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the...
Stacked die package
A stacked die package includes a substrate or interposer board that includes a contact area on a top surface and landing pads surrounding the contact area....
Integrated electronic component
An integrated electronic component having a substrate, a metal multilayer system, which is arranged at least on regions of the substrate, and a nonconductive...
Method and circuit arrangement for testing electrical modules
The invention relates to a method for testing electrical modules. A test pattern of input signals is applied to each module to be tested as test specimen, and...
Synchronous signal generator
A synchronous signal generator is provided that contains a first and second counting and delay circuit, which both are in a subhierarchical position with respect...
Method for setting up a program-controlled circuit arrangement and circuit
arrangement for execution of the method
In the case of devices with a program-controlled circuit arrangement operating program instructions are necessary for their operation. In order to reduce the...
Recovering clock and frame information from data stream
A method for transmitting a digital data stream includes recovery of data clock information and data frame information from the digital data stream. The method...
Bridge circuit to suppress echoes in communication devices
Bridge circuit for echo suppression for a reception signal of a communication device connected to a transmission line, to which can be supplied a reception...
Sense amplifier organization for twin cell memory devices
A semiconductor memory device is provided that uses a single wordline to access both storage cells of a so-called twin cell. A memory device comprises a...
Phase change memory fabricated using self-aligned processing
A memory includes transistors in rows and columns providing an array, conductive lines in columns across the array, and phase change elements contacting the...
Input circuit for receiving an input signal, and a method for adjusting an
operating point of an input circuit
The present invention relates to an input circuit for receiving an input signal in an integrated circuit, having a differential amplifier whose first input can...
Integrated charge pump
An integrated charge pump is provided, comprising: a pump capacitor having a first terminal and a second terminal; a control unit, which operates the charge pump...
Circuit arrangement and method for producing a dual-rail signal
Circuit arrangement for producing a dual-rail output signal having a signal processing apparatus with two switches, which are driven as a function of an input...
A read out device for reading out a data word from a memory cell is described. The read out device has memory cells, inputs for input variables for selecting a...
Magnetoresistive sensor element and method of assembling magnetic field
sensor elements with on-wafer...
A method of performing an on-wafer function testis provided for multiple magnetic field sensor elements on a wafer. Each sensor element includes a ...
Contact plate for use in standardizing tester channels of a tester system
and a standardization system having...
One embodiment of the invention provides a standardization module for use in standardizing tester channels of a tester unit using a standardization unit for...
SONOS memory cells and arrays and method of forming the same
A trench (2) is fabricated in a silicon body (1). The walls (4) of the trench are provided with a nitrogen implantation (6). An oxide layer between the...
Method for fabricating an NROM memory cell arrangement
In the method, trenches (9) are etched and, in between, bit lines (8) are in each case arranged on doped source drain/regions (3). Dopant is introduced into the...
Mounting method for a semiconductor component
A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one...
Data transmission system with reduced power consumption
System and method for reducing power consumption and noise in a transmission system with an asymmetrically terminated transmission line. A preferred embodiment...
DRAM memory cell arrangement
The present invention relates to a memory cell arrangement comprising a multiplicity of DRAM memory cells which are arranged in cell rows and cell columns and...
Electronic circuit apparatus and method for stacking electronic circuit
The invention provides an electronic circuit apparatus having a plurality of electronic circuit units (101a-101n), a circuit board (102) and a connection unit...
Driver circuit for binary signals
The invention relates to a driver circuit for binary signals, said circuit having two branch circuits which are connected in parallel with one another between an...
Input circuit for an integrated circuit
An integrated circuit includes a functional circuit, a setting memory for storing a setting data item and an input circuit for receiving signals via an input...
Electronic component comprising an electrically conductive connection
consisting of carbon nanotubes and a...
The invention provides in a preferred embodiment an electronic component comprising a first conductive layer, a non-conductive layer and a second conductive...
Method of forming a contact in a flash memory device
A method of forming a contact between a bitline and a local interconnect in a flash memory device comprises forming a hard mask layer on a planarized surface...
Electronic component with a housing package
The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and...
Deformation sensor and method for detecting a deformation
A sensor has a substrate having a mechanically deformable region, a magnetostrictive spin-valve sensor element being arranged to detect a mechanical deformation...
Multi-layer electrode and method of forming the same
An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is...
Semiconductor component with switching element configured to reduce
parasitic current flow
A semiconductor component is described. In one embodiment, the semiconductor component includes a switching element integrated in the semiconductor component...
Resistive semiconductor element based on a solid-state ion conductor
A nonvolatile, resistively switching memory cell has a layer of a porous dielectric between a first electrode. The dielectric is not a chalcogenide.
Method and apparatus for characterizing a recess located on a surface of a
Method and apparatus for characterizing a recess located on a surface of a substrate are provided. One embodiment of the invention provides a method for...
Resistless lithography method for fabricating fine structures
A resistless lithography method for fabricating fine stiuctures is disclosed. IN an embodiment, a semiconductor mask layer (HM) may be formed on a carrier...
Method and device for packaging and transporting electronic components
The invention relates to an apparatus and a method for packaging and for transporting electronic devices. The devices include coverings made of a material that...
Demodulator and demodulation method for demodulating received signals
The invention relates to a demodulator and also a demodulation method and enables a reliable demodulation even when the intermediate frequency range overlaps the...
Semiconductor memory device, system with semiconductor memory device, and
method for operating a semiconductor...
The invention relates to a semiconductor memory device, a system with a semiconductor memory device, and a method for operating a semiconductor memory device,...
Semi-conductor memory component, and a process for operating a
semi-conductor memory component
The invention relates to a semi-conductor memory component and process for operating a semi-conductor memory component, including activating the memory cells of...
Method for reading Uniform Channel Program (UCP) flash memory cells
A flash memory cell can be read by selecting a local bit line. A read potential is applied to a memory cell transistor associated with the local bit line thereby...
Integrated circuit with electrostatic discharge protection
An integrated circuit with electrostatic discharge protection includes a first transistor with a source terminal, a drain terminal and a gate terminal, and a...
Signal test procedure for testing semi-conductor components and a test
apparatus for testing semi-conductor...
The invention relates to a test apparatus for testing semi-conductor components, and to a signal testing procedure, to be used especially during the testing of...
Ohmic contact configuration
A contact configuration has an ohmic contact between a metalization layer and a semiconductor body of monocrystalline semiconductor material. An amorphous...
Multichip module including a plurality of semiconductor chips, and printed
circuit board including a plurality...
A multichip module includes at least one first semiconductor chip and at least one second semiconductor chip. The semiconductor chips are arranged in coplanar...
Memory module having memory chips protected from excessive heat
The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed...
Method of producing a microelectronic electrode structure, and
microelectronic electrode structure
In a method for producing a microelectronic electrode structure a first wiring plane is prepared, an insulating region on the first wiring plane is provided, a...
Method for forming ferrocapacitors and FeRAM devices
Ferrocapacitors having a vertical structure are formed by a process in which a ferroelectric layer is deposited over an insulator. In a first etching stage, the...
High dielectric constant materials
A capacitor (10) includes a substrate (12) and two metal electrodes (14, 18). A dielectric layer (16) is formed between the electrodes. Preferably, the...