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Patent # Description
US-9,502,338 Semiconductor package with switch node integrated heat spreader
In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also...
US-9,502,296 Preventing delamination and cracks in fabrication of group III-V devices
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,502,248 Methods for making a semiconductor chip device
According to various embodiments, a method may include: forming a first layer on a surface using a first lift-off process; forming a second layer over the first...
US-9,501,966 Gate driver with multiple slopes for plasma display panels
According to an exemplary embodiment, a driver circuit for generating a reset pulse of an output waveform includes a plurality of ramp paths, each ramp path...
US-9,501,075 Low-dropout voltage regulator
A low-dropout voltage regulator includes a power transistor configured to receive an input voltage and to provide a regulated output voltage at an output...
US-9,496,888 Asynchronous SAR ADC with binary scaled redundancy
Representative implementations of devices and techniques provide analog to digital conversion of time-discrete analog inputs. A redundant binary scaled...
US-9,496,872 Method for manufacturing a digital circuit and digital circuit
A method for manufacturing a digital circuit is described including forming a plurality of field effect transistor pairs, connecting the field effect...
US-9,496,867 Integrated hall-controlled switch devices
Embodiments relate to Hall-controlled switch devices. In an embodiment, a Hall switch and a load switch are integrated in a single integrated circuit device....
US-9,496,859 Circuit arrangement with a first semiconductor device and with a plurality of second semiconductor devices
A circuit arrangement includes a first semiconductor device having a load path and a number of second semiconductor devices. Each second semiconductor device...
US-9,496,824 Oscillator circuit
The disclosure provides an oscillator circuit for a voltage controlled oscillator. The oscillator circuit includes first and second coupled transmission lines,...
US-9,496,791 Multiphase buck converter with dynamic phase firing
Methods, devices, and circuits are disclosed for a multiphase buck converter with dynamic phase firing that moderates phase output current. In one example, a...
US-9,496,378 IGBT with buried emitter electrode
There are disclosed herein various implementations of an insulated gate bipolar transistor (IGBT) with buried emitter electrodes. Such an IGBT may include a...
US-9,496,364 Field effect semiconductor component and methods for operating and producing it
In accordance with one component, a power field effect transistor is proposed, including a substrate, a channel, a gate electrode, and a gate insulator. The...
US-9,496,351 Semiconductor chip arrangement
A method for processing a semiconductor carrier is provided, the method including: providing a semiconductor carrier including a doped substrate region and a...
US-9,496,346 Silicon carbide device and a method for forming a silicon carbide device
A silicon carbide device includes a silicon carbide substrate, an inorganic passivation layer structure and a molding material layer. The inorganic passivation...
US-9,496,339 Semiconductor device comprising trench structures
A semiconductor device includes a central portion and an edge termination portion outside the central portion. The central portion includes a transistor cell...
US-9,496,337 Method for producing a semiconductor device having a beveled edge termination
A method for producing a semiconductor device includes forming a trench that defines a closed loop in a semiconductor body and extends from a first surface into...
US-9,496,245 Semiconductor package with integrated semiconductor devices and passive component
According to one exemplary embodiment, a semiconductor package includes a substrate having lower and upper surfaces. The semiconductor package further includes...
US-9,496,237 Semiconductor device having solderable and bondable electrical contact pads
A semiconductor device includes a semiconductor chip and a plurality of electrical contact pads disposed on a main face of the semiconductor chip, wherein the...
US-9,496,228 Integrated circuit and method of manufacturing an integrated circuit
In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite...
US-9,496,205 Power semiconductor package
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body,...
US-9,496,193 Semiconductor chip with structured sidewalls
A semiconductor chip includes a body having a frontside, a backside opposite the frontside, and sidewalls extending between the backside and frontside, at least...
US-9,496,168 Semiconductor package with via-coupled power transistors
In one implementation, a semiconductor package includes a carrier including first and second conductive segments, and first and second transistors attached...
US-9,495,317 Bus driver circuit with improved transition speed
A bus driver circuit may include a first and a second circuit node, wherein the first circuit node is operably coupled to a bus line, which causes a bus...
US-9,494,636 Floating connector safety protection
In one example, a method includes outputting, during a first phase, a first current level at a connector, and outputting, during a second phase, a second...
US-9,494,477 Dynamic pressure sensor
According to various embodiments, a dynamic pressure sensor includes a substrate, a reference volume formed in the substrate, a deflectable membrane sealing the...
US-9,494,468 Method of examining a substrate and corresponding device
A method of examining a substrate is provided. The method may include: generating a temperature gradient along a surface of the substrate; detecting a heat...
US-9,490,870 Signal transmission arrangement with a transformer and signal transmission method
In accordance with an embodiment, a sender circuit is configured to be coupled to a receiver circuit and generate a drive signal dependent on a data input...
US-9,490,852 Multiple input and multiple output switch network
According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch...
US-9,490,787 System and method for integrated circuit clock distribution
An embodiment integrated circuit (IC) clock distributor system includes a first IC. The first IC includes a clock synchronizer circuit and a clock generator...
US-9,490,719 System and method for a power converter
According to an embodiment, a power supply controller includes a first controller, a second controller, a transformation circuit, a switch signal generator. The...
US-9,490,354 Insulated gate bipolar transistor
A semiconductor body of an IGBT includes: a first base region of a second conductivity type; a source region of a first conductivity type different from the...
US-9,490,250 Half-bridge circuit with a low-side transistor and a level shifter transistor integrated in a common...
A half-bridge circuit includes a low-side transistor and a high-side transistor each having a load path and a control terminal. The half-bridge circuit further...
US-9,490,244 Integrated circuit comprising a clamping structure and method of adjusting a threshold voltage of a clamping...
An integrated circuit comprises a load transistor including first and second load terminals and a load control terminal. The integrated circuit further...
US-9,490,206 Electrical device and fabrication method
An electrical device with a fin structure, a first section of the fin structure having a first width and a first height, a second section of the fin structure...
US-9,490,199 Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements
An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a...
US-9,490,193 Electronic device with multi-layer contact
The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and...
US-9,490,173 Method for processing wafer
A method for processing a wafer including a plurality of chips is provided. The method may include: forming a trench in the wafer between the plurality of...
US-9,490,172 Method for preventing delamination and cracks in group III-V wafers
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,490,103 Separation of chips on a substrate
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is...
US-9,489,994 Memory timing circuit
A memory circuit including a memory cell configured to provide a charge, voltage, or current to an associated bit-line; a sense amplifier configured to sense...
US-9,489,607 Semiconductor device and an identification tag
A semiconductor device includes a semiconductor substrate, a battery attached to the semiconductor substrate, and a sensor attached to the semiconductor...
US-9,488,995 Voltage converter and voltage conversion method having multiple converter stages
A voltage converter includes a first converter stage including a unipolar transistor coupled to a first inductive storage element, where the first converter...
US-9,488,700 Magnetic field sensors and systems with sensor circuit portions having different bias voltages and frequency ranges
Embodiments relate to Hall effect sensor circuits and devices that provide improved performance, such as reduced residual offset errors and/or improved S/N...
US-9,488,674 Testing device and a circuit arrangement
A testing device in accordance with various embodiments may include: a plurality of first terminals configured to be connected to a plurality of ...
US-9,488,505 Circuit, method and sensor for obtaining information on a physical quantity
A circuit for obtaining information on a physical quantity according to an embodiment includes a sensor arrangement sensitive to the physical quantity, at least...
US-9,488,498 Cam shaft rotation sensor
A sensor device is provided with a magnetic field sensitive element to be positioned in a magnetic field of a magnet. The magnet is positioned on an end face of...
US-9,487,392 Method of packaging integrated circuits and a molded package
A method of packaging integrated circuits includes providing a molded substrate that has a plurality of first semiconductor dies and a plurality of second...
US-9,487,386 Comb MEMS device and method of making a comb MEMS device
A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming...
US-9,485,818 Adaptive direct current (DC) to DC (DC-to-DC) light emitting diode (LED) driver for dynamic loads
Current spikes may occur when dynamically shortening a light emitting diode chain. These current spikes can be avoided by using a voltage control loop to...
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