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Patent # Description
US-1,041,8319 Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes providing an electrically conductive carrier and placing a semiconductor chip over the carrier. The...
US-1,041,8313 Electronic module comprising a plurality of encapsulation layers and a method for producing it
An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main...
US-1,041,6296 3DI sensor depth calibration concept using difference frequency approach
A three-dimensional image 3DI system includes a modulator configured to generate a first modulation signal and a second modulation signal having a predetermined...
US-1,041,6284 Method and device for processing radar signals
An example relates to a method for processing radar signals, wherein said radar signals comprise digitized data received by at least one radar antenna, the...
US-1,041,6001 Magnet arrangement for rotational angle detection
A ring magnet for use in determining a rotational angle of a rotatable shaft and configured to be connected to the rotatable shaft for co-rotation with the...
US-1,041,5999 Rotation angle sensor system and method
Rotational angle sensor systems and methods are provided for detecting an angular position of a movable structure. The movable structure may be configured to...
US-1,041,1883 Devices and methods for multi-channel sampling
Devices for sampling a plurality of input signals are provided, wherein a sampling device is controlled to sample the input signals in a random order with...
US-1,041,1693 Methods and circuits for improved reliability of power devices operating under repetitive thermal stress
Thermo-migration induced stress in power devices can be mitigated by deactivating a subset of power device components (e.g., transistors, etc.) when the power...
US-1,041,1689 Increase robustness of devices to overvoltage transients
In one example, a method includes selectively activating, by control logic and based on a control signal, a switch; in response to determining that an...
US-1,041,1507 Circuit arrangement
In accordance with various embodiments, a circuit arrangement may include a first circuit, which is designed for contactless communication, and a second...
US-1,041,1126 Semiconductor device having a first through contact structure in ohmic contact with the gate electrode
A semiconductor device includes an electrically conductive lead frame which includes a die pad and a plurality of electrically conductive leads, each of the...
US-1,041,1124 Semiconductor component with protrusion propagation body and corresponding methods of manufacture
A semiconductor structure includes a substrate, a III-Nitride intermediate stack including the protrusion propagation body situated over the substrate, a...
US-1,041,1097 Semiconductor component having a doped substrate layer and corresponding methods of manufacturing
Representative implementations of devices and techniques provide an optimized layer for a semiconductor component. In an example, a doped portion of a wafer,...
US-1,041,1060 Method of manufacturing an imager and imager device
Embodiments related to a method of manufacturing of an imager and an imager device are shown and depicted.
US-1,041,1008 System and method for depletion mode and enhancement mode transistors
Circuits and devices for bidirectional normally-off switches are described. A circuit for a bidirectional normally-off switch includes a depletion mode...
US-1,041,1006 Poly silicon based interface protection
A semiconductor device includes an active device of a transistor disposed in a semiconductor substrate. An isolation layer is disposed at the semiconductor...
US-1,041,0980 Semiconductor chip
According to one embodiment, a semiconductor chip is described including a semiconductor chip body and a semiconductor chip circuit on the body and including a...
US-1,041,0956 LDMOS transistor and method
In an embodiment, a semiconductor device includes a semiconductor substrate, a LDMOS transistor arranged in a front surface of the semiconductor substrate and a...
US-1,041,0952 Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based...
Power semiconductor packages described herein each include a substrate having two or more metal layers and one or more insulating layers for separating the...
US-1,041,0949 Package with roughened encapsulated surface for promoting adhesion
A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and...
US-1,041,0911 Buried insulator regions and methods of formation thereof
A method of fabricating a semiconductor device includes forming a buried insulation region within a substrate by processing the substrate using etching and...
US-1,040,8919 RF system with an RFIC and antenna system
In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has...
US-1,040,7639 Lubricating oil additives
A lubricating composition comprises an oil-soluble poly(2-oxazoline) additive having the repeat unit: --N(COR.sup.1)CH.sub.2CH.sub.2-- where the number of...
US-1,040,5118 Semiconductor devices having a membrane layer with smooth stress-relieving corrugations and methods of...
In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface...
US-1,040,5099 MEMS device and method for producing a MEMS device
A MEMS device is provided. The MEMS device includes a membrane, and at least one electrode arranged at a distance from the membrane. The at least one electrode...
US-1,040,4448 Communication devices, method for detecting an edge in a received signal and method for receiving data
A communication device includes a sampler configured to sample an input signal, wherein the sampler is configured to generate a sampled value for each sampling...
US-1,040,4250 Transistor device
Transistor devices are described that include a first transistor and a second transistor coupled in parallel between a first terminal and a second terminal. The...
US-1,040,4233 Tunable resonator element, filter circuit and method
A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second resonator. The first...
US-1,040,4182 Bi-directional resonant power converter with two tank circuits on one side of a transformer
In some examples, a power converter includes a first bridge circuit, a second bridge circuit, and a transformer, where a first side of the transformer is...
US-1,040,4171 Power converter circuit with a switched mode power converter that is switched based upon a measured inductor...
Disclosed is a power converter circuit and a method for operating the power converter circuit. The power converter circuit includes at least one converter stage...
US-1,040,3813 Method for forming a magnetoresistive device
Embodiments relate to magnetoresistive (xMR) sensors. In an embodiment, an xMR stack structure is configured to form two different xMR elements that can be...
US-1,040,3728 Semiconductor devices having field electrode trenches
A semiconductor device includes needle-shaped trenches in a semiconductor substrate, each of which includes a field electrode electrically insulated from the...
US-1,040,3725 Method for processing a semiconductor workpiece and semiconductor device
A method for processing a semiconductor workpiece, including: forming a trench structure in a first region of a semiconductor workpiece, extending from a...
US-1,040,3724 Semiconductor wafer
In an embodiment, a semiconductor wafer includes a substrate wafer having a device surface region surrounded by a peripheral region, one or more mesas including...
US-1,040,3712 Combined gate trench and contact etch process and related structure
A method of forming a semiconductor device, the method comprises forming a gate trench and a contact trench concurrently in a semiconductor substrate using a...
US-1,040,3556 Semiconductor device including a heat sink structure
A semiconductor device includes a drift structure formed in a semiconductor body. The drift structure forms a first pn junction with a body zone of a transistor...
US-1,040,3506 Separation of workpiece with three material removal stages
A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first...
US-1,040,3496 Compound semiconductor substrate and method of forming a compound semiconductor substrate
A method of forming a compound semiconductor substrate includes providing a crystalline base substrate having a first semiconductor material and a main surface,...
US-1,040,3468 Energy filter for processing a power semiconductor device
A method of producing an implantation ion energy filter, suitable for processing a power semiconductor device. In one example, the method includes creating a...
US-1,040,3428 Winding module, hybrid transformer, module and circuit for DC-DC power conversion
In an embodiment, a DC-DC power conversion circuit with a step-down conversion ratio of at least 12:1 is provided. The DC-DC power conversion circuit includes a...
US-1,040,1409 Capacitance determination circuit and method for determining a capacitance
According to an embodiment, a capacitance determination circuit is provided comprising a voltage controlled oscillator configured to generate a frequency signal...
US-1,040,1159 Apparatus for detecting a pre-aligning element at a wafer
An apparatus for detecting a pre-aligning element at a wafer and a method for pre-aligning a wafer are disclosed. In an embodiment, the apparatus includes a...
US-1,039,9394 Single axis earth magnetic field sensor for motion detection in TPMS application
A sensor module is provided that includes a magnetic sensor and a microcontroller. The magnetic sensor is configured to measure a magnitude of a magnetic field...
US-1,039,9393 Radar sensor system for tire monitoring
A system includes a millimeter-wave radar sensor circuit configured to be fastened to a wheel having a tire, and a controller. The millimeter-wave radar sensor...
US-1,039,7709 Microelectromechanical microphone
A microelectromechanical microphone includes a planar first electrode that is formed, at least in portions, from an electrically conductive material, a planar...
US-1,039,6857 Data transmission
A method for data transmission, wherein a first element conveys electrical power to a second element via an electrical supply line, and wherein the second...
US-1,039,6836 Electronic circuit with a ringing suppression circuit, network, and method for operating the electronic circuit
An electronic circuit includes a transmitter with a first output configured to be connected to a first signal line of a signal bus, a second output configured...
US-1,039,6663 Multiphase regulator with current pattern matching
According to an embodiment, a multiphase regulator includes a plurality of output phases each of which is operable to deliver a phase current through a separate...
US-1,039,6170 Semiconductor devices and methods for forming semiconductor devices
A semiconductor device includes a transistor doping region of a vertical transistor structure arranged in a semiconductor substrate. Additionally, the...
US-1,039,6074 Power semiconductor device having different channel regions
A power semiconductor device includes a semiconductor body coupled to first and second load terminal structures, and first and second cells each configured for...
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