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Patent # Description
US-9,595,502 Spring contact for semiconductor chip
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main...
US-9,595,487 Circuit arrangement and method for manufacturing the same
Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a...
US-9,595,469 Semiconductor device and method for producing the same
A semiconductor device includes a semiconductor body with a front face and a back face, having an active zone located at the front face, a front surface...
US-9,595,465 Vias and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a first metal line in a first insulating layer, and a via having a...
US-9,595,354 Nonvolatile memory refresh
A system and method of refreshing a nonvolatile memory having memory cells. The method includes identifying one or more of the memory cells that do not satisfy...
US-9,594,124 Battery charge meter testing
A circuit includes a first analog to digital converter configured to convert an analog voltage sample of a rechargeable power source into a digital voltage...
US-9,594,111 Turret handlers and methods of operations thereof
In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret...
US-9,594,097 DC decoupled current measurement
A circuit arrangement for measuring a load current provided to a load via a first load terminal of a load transistor is disclosed. In accordance with one...
US-9,593,009 Apparatus comprising and a method for manufacturing an embedded MEMS device
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main...
US-9,591,408 Adjustable ventilation openings in MEMS structures
A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure...
US-9,590,810 Device security
Methods for securing and activating chips and/or devices that can utilize a hardware security module (HSM). One or more of the methods can include generating...
US-9,590,653 Method and device for use in analog-to-digital conversion
Disclosed herein are embodiments of a precharge sample-and-hold circuit. The circuit has an input terminal, a reference voltage terminal and an output terminal....
US-9,590,577 Linearized high-ohmic resistor
Representative implementations of devices and techniques provide a linearized high-ohmic resistor. In an example, a quantity of serially connected nonlinear...
US-9,590,513 Methods for operating a converter
A converter may include a transformer; a first circuit arrangement coupled to a first transformer side; a second circuit arrangement coupled to a second...
US-9,590,507 Auxiliary supply for a switched-mode power supply controller using bang-bang regulation
A method in a switched-mode power supply (SMPS) and SMPS circuits are provided. The method and circuits use bang-bang regulation to provide for an auxiliary...
US-9,590,492 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes starting up the switched-mode power supply by applying a first...
US-9,590,096 Vertical FET having reduced on-resistance
In one implementation, a vertical field-effect transistor (FET) includes a substrate having a drift region situated over a drain, a body region situated over...
US-9,590,095 Semiconductor device with field electrode structures in a cell area and termination structures in an edge area
A semiconductor device includes field electrode structures regularly arranged in lines in a cell area and forming a first portion of a regular pattern....
US-9,590,094 Semiconductor device with power transistor cells and lateral transistors and method of manufacturing
By thermal oxidation a field oxide layer is formed that lines first and second trenches that extend from a main surface into a semiconductor layer. After the...
US-9,590,091 Minority carrier conversion structure
According to an embodiment of a semiconductor device, the semiconductor device includes a power device well in a semiconductor substrate, a logic device well in...
US-9,590,087 Compound gated semiconductor device having semiconductor field plate
A transistor includes a source, a drain spaced apart from the source, and a heterostructure body having a two-dimensional charge carrier gas channel for...
US-9,590,062 Insulating block in a semiconductor trench
A semiconductor device is produced by: creating an opening in a mask formed on a semiconductor body; creating, underneath the opening, a trench in the...
US-9,590,048 Electronic device
In an embodiment, an electronic device includes a semiconductor layer having a surface, a gate and a first current electrode on the surface and a dielectric...
US-9,590,044 Two-dimensional material containing electronic components
In various embodiments, an electronic component is provided. The electronic component may include a dielectric structure; and a two-dimensional material...
US-9,589,922 Electronic module and method of manufacturing the same
An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first...
US-9,589,916 Inductively coupled transformer with tunable impedance match network
A packaged RF power transistor includes an RF input lead, a DC gate bias lead, an RF power transistor comprising gate, source and drain terminals, and an input...
US-9,589,914 Semiconductor chip
According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the...
US-9,589,904 Semiconductor device with bypass functionality and method thereof
A device includes a semiconductor chip and a bypass layer electrically coupled to a contact region of the semiconductor chip. The bypass layer is configured to...
US-9,589,880 Method for processing a wafer and wafer structure
A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a...
US-9,589,872 Integrated dual power converter package having internal driver IC
An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a...
US-9,589,859 Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a...
A semiconductor arrangement includes a plurality of chip assemblies, each of which includes a semiconductor chip having a semiconductor body with a top side and...
US-9,589,168 Automatic storage scheme by simultaneous ID recognition
A code input device is used to simultaneously read a first code and a second code. The code input device includes at least one of a camera or a field reader. A...
US-9,588,532 Voltage regulator having an emulated ripple generator
According to an exemplary implementation, a voltage regulator includes an emulated ripple generator. The emulated ripple generator includes a high side switch...
US-9,588,171 System and method for testing an integrated circuit
In accordance with an embodiment, a method of testing an integrated circuit, includes receiving a supply voltage on the integrated circuit via a first input...
US-9,588,134 Increased dynamic range sensor
Some aspects of the present disclosure provide for a sensor system having a large range between minimum and maximum allowed input quantities. In some...
US-9,585,241 Substrate, chip arrangement, and method for manufacturing the same
In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a...
US-9,584,941 Micromechanical digital loudspeaker
A digital loudspeaker and a method for operating a digital loudspeaker are disclosed. In an embodiment a digital loudspeaker includes a substrate, a first...
US-9,584,889 System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding...
US-9,584,150 Gain calibration for ADC with external reference
Representative implementations of devices and techniques provide gain calibration for analog to digital conversion of time-discrete analog inputs. An adjustable...
US-9,584,097 System and method for a switchable capacitance
In accordance with an embodiment, a switchable capacitance circuit includes a plurality of capacitance-switch cells that each have a capacitance circuit having...
US-9,584,034 Power converter circuit and method with asymmetrical half bridge
A power converter circuit includes a power converter with a plurality of series connected converter cells. Each of the plurality of converter cells includes at...
US-9,584,022 System and method for a switched-mode power supply
In accordance with an embodiment, a method includes receiving an indication of a changed load condition or voltage characteristic of a power supply providing...
US-9,583,811 Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and...
A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package....
US-9,583,595 Methods of forming low noise semiconductor devices
Disclosed herein are Lateral Diffused Metal Oxide Semiconductor (LDMOS) device and trench isolation related devices, methods, and techniques. In one...
US-9,583,578 Semiconductor device including an edge area and method of manufacturing a semiconductor device
A semiconductor portion of a semiconductor device includes a semiconductor layer with a drift zone of a first conductivity type and at least one impurity zone...
US-9,583,565 Semiconductor device with isolating layer on side and bottom surfaces
A method for manufacturing a semiconductor device comprises includes providing a substrate with a surface, forming an isolating layer on part of the surface,...
US-9,583,559 Capacitor having a top compressive polycrystalline plate
In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline...
US-9,583,477 Stacked half-bridge package
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input,...
US-9,583,444 Method for applying magnetic shielding layer, method for manufacturing a die, die and system
A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the...
US-9,583,413 Semiconductor device
A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator...
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