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Spring contact for semiconductor chip
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main...
Circuit arrangement and method for manufacturing the same
Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a...
Semiconductor device and method for producing the same
A semiconductor device includes a semiconductor body with a front face and a back face, having an active zone located at the front face, a front surface...
Vias and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a first metal line in a first insulating layer, and a via having a...
Nonvolatile memory refresh
A system and method of refreshing a nonvolatile memory having memory cells. The method includes identifying one or more of the memory cells that do not satisfy...
Battery charge meter testing
A circuit includes a first analog to digital converter configured to convert an analog voltage sample of a rechargeable power source into a digital voltage...
Turret handlers and methods of operations thereof
In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret...
DC decoupled current measurement
A circuit arrangement for measuring a load current provided to a load via a first load terminal of a load transistor is disclosed. In accordance with one...
Apparatus comprising and a method for manufacturing an embedded MEMS
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main...
Adjustable ventilation openings in MEMS structures
A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure...
Methods for securing and activating chips and/or devices that can utilize a hardware security module (HSM). One or more of the methods can include generating...
Method and device for use in analog-to-digital conversion
Disclosed herein are embodiments of a precharge sample-and-hold circuit. The circuit has an input terminal, a reference voltage terminal and an output terminal....
Linearized high-ohmic resistor
Representative implementations of devices and techniques provide a linearized high-ohmic resistor. In an example, a quantity of serially connected nonlinear...
Methods for operating a converter
A converter may include a transformer; a first circuit arrangement coupled to a first transformer side; a second circuit arrangement coupled to a second...
Auxiliary supply for a switched-mode power supply controller using
A method in a switched-mode power supply (SMPS) and SMPS circuits are provided. The method and circuits use bang-bang regulation to provide for an auxiliary...
System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes starting up the switched-mode power supply by applying a first...
Vertical FET having reduced on-resistance
In one implementation, a vertical field-effect transistor (FET) includes a substrate having a drift region situated over a drain, a body region situated over...
Semiconductor device with field electrode structures in a cell area and
termination structures in an edge area
A semiconductor device includes field electrode structures regularly arranged in lines in a cell area and forming a first portion of a regular pattern....
Semiconductor device with power transistor cells and lateral transistors
and method of manufacturing
By thermal oxidation a field oxide layer is formed that lines first and second trenches that extend from a main surface into a semiconductor layer. After the...
Minority carrier conversion structure
According to an embodiment of a semiconductor device, the semiconductor device includes a power device well in a semiconductor substrate, a logic device well in...
Compound gated semiconductor device having semiconductor field plate
A transistor includes a source, a drain spaced apart from the source, and a heterostructure body having a two-dimensional charge carrier gas channel for...
Insulating block in a semiconductor trench
A semiconductor device is produced by: creating an opening in a mask formed on a semiconductor body; creating, underneath the opening, a trench in the...
In an embodiment, an electronic device includes a semiconductor layer having a surface, a gate and a first current electrode on the surface and a dielectric...
Two-dimensional material containing electronic components
In various embodiments, an electronic component is provided. The electronic component may include a dielectric structure; and a two-dimensional material...
Electronic module and method of manufacturing the same
An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first...
Inductively coupled transformer with tunable impedance match network
A packaged RF power transistor includes an RF input lead, a DC gate bias lead, an RF power transistor comprising gate, source and drain terminals, and an input...
According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the...
Semiconductor device with bypass functionality and method thereof
A device includes a semiconductor chip and a bypass layer electrically coupled to a contact region of the semiconductor chip. The bypass layer is configured to...
Method for processing a wafer and wafer structure
A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a...
Integrated dual power converter package having internal driver IC
An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a...
Semiconductor arrangement, method for producing a number of chip
assemblies and method for producing a...
A semiconductor arrangement includes a plurality of chip assemblies, each of which includes a semiconductor chip having a semiconductor body with a top side and...
Automatic storage scheme by simultaneous ID recognition
A code input device is used to simultaneously read a first code and a second code. The code input device includes at least one of a camera or a field reader. A...
Voltage regulator having an emulated ripple generator
According to an exemplary implementation, a voltage regulator includes an emulated ripple generator. The emulated ripple generator includes a high side switch...
System and method for testing an integrated circuit
In accordance with an embodiment, a method of testing an integrated circuit, includes receiving a supply voltage on the integrated circuit via a first input...
Increased dynamic range sensor
Some aspects of the present disclosure provide for a sensor system having a large range between minimum and maximum allowed input quantities. In some...
Substrate, chip arrangement, and method for manufacturing the same
In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a...
Micromechanical digital loudspeaker
A digital loudspeaker and a method for operating a digital loudspeaker are disclosed. In an embodiment a digital loudspeaker includes a substrate, a first...
System and method for packaged MEMS device having embedding arrangement,
MEMS die, and grille
A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding...
Gain calibration for ADC with external reference
Representative implementations of devices and techniques provide gain calibration for analog to digital conversion of time-discrete analog inputs. An adjustable...
System and method for a switchable capacitance
In accordance with an embodiment, a switchable capacitance circuit includes a plurality of capacitance-switch cells that each have a capacitance circuit having...
Power converter circuit and method with asymmetrical half bridge
A power converter circuit includes a power converter with a plurality of series connected converter cells. Each of the plurality of converter cells includes at...
System and method for a switched-mode power supply
In accordance with an embodiment, a method includes receiving an indication of a changed load condition or voltage characteristic of a power supply providing...
Transition between a plastic waveguide and a semiconductor chip, where the
semiconductor chip is embedded and...
A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package....
Methods of forming low noise semiconductor devices
Disclosed herein are Lateral Diffused Metal Oxide Semiconductor (LDMOS) device and trench isolation related devices, methods, and techniques. In one...
Semiconductor device including an edge area and method of manufacturing a
A semiconductor portion of a semiconductor device includes a semiconductor layer with a drift zone of a first conductivity type and at least one impurity zone...
Semiconductor device with isolating layer on side and bottom surfaces
A method for manufacturing a semiconductor device comprises includes providing a substrate with a surface, forming an isolating layer on part of the surface,...
Capacitor having a top compressive polycrystalline plate
In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline...
Stacked half-bridge package
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input,...
Method for applying magnetic shielding layer, method for manufacturing a
die, die and system
A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the...
A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator...