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Patent # Description
US-9,844,134 Device including a metallization layer and method of manufacturing a device
A device comprises a base element and a metallization layer over the base element. The metallization layer comprises pores and has a varying degree of porosity,...
US-9,843,862 System and method for a pumping speaker
According to an embodiment, a method of operating a speaker with an acoustic pump includes generating a carrier signal having a first frequency by exciting the...
US-9,843,319 System and method for a fault protection circuit
According to an embodiment, a fault protection system includes a first power supply terminal, a second power supply terminal, an error circuit configured to...
US-9,843,257 Set point independent regulation of a switched mode power converter
A controller for controlling a power converter includes an analog-to-digital converter (ADC) configured to output, based on a received analog voltage, a first...
US-9,843,181 Semiconductor device including a control circuit
A semiconductor device includes a semiconductor portion with a main FET and a control circuit. The main FET includes a gate electrode to control a current flow...
US-9,842,904 Method of manufacturing a semiconductor device having a trench at least partially filled with a conductive...
A method of manufacturing a semiconductor device includes forming a first trench in a semiconductor substrate from a first side, forming a semiconductor layer...
US-9,842,901 Semiconductor device with first and second field electrode structures
A semiconductor device includes first and second field electrode structures that extend from a first surface into a semiconductor portion. The first field...
US-9,841,497 Method, device and system for processing radar signals
A device is suggested for processing input data received by several antennas, the device including a processing unit including a buffer and at least one...
US-9,841,359 Extraction of tire characteristics combining direct TPMS and tire resonance analysis
Embodiments relate to tire characterization systems and methods for combining direct tire pressure monitoring systems (TPMS) and tire resonance analysis in...
US-9,835,657 Accessory presence detection
Disclosed is an electronic circuit with a first terminal for connecting an accessory thereto, and with a functionality for detecting the presence of an...
US-9,835,472 Using cartesian coordinates for position detection with a magnetic sensor
A magnetic sensor, may sense a first magnetic field component corresponding to a first axis of a magnetic field produced by a magnet. The magnetic sensor may...
US-9,831,856 Electronic drive circuit and method
Disclosed is an electronic drive circuit and a drive method. The drive circuit includes an output; a first output transistor comprising a control node and a...
US-9,831,782 Switched mode power supply with secondary-side power regulation
It is possible to achieve more precise power regulation in switched mode power supply systems by performing at least some control-loop processing on the...
US-9,831,773 Current sensing in a power supply
During operation, a protection circuit receives an input voltage representative of current delivered by a power supply phase to a load. In one configuration,...
US-9,831,330 Bipolar semiconductor device having a deep charge-balanced structure
There are disclosed herein various implementations of a bipolar semiconductor device having a deep charge-balanced structure. Such a device includes a drift...
US-9,831,312 Group III-V device structure having a selectively reduced impurity concentration
There are disclosed herein various implementations of a semiconductor structure and method. The semiconductor structure comprises a substrate, a transition body...
US-9,831,171 Capacitors with barrier dielectric layers, and methods of formation thereof
A device including a first metal feature is disposed in a first insulating layer. A second metal feature is disposed in a second insulating layer and separated...
US-9,831,168 Electrical connectivity of die to a host substrate
According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A...
US-9,831,159 Semiconductor package with embedded output inductor
In one implementation, a semiconductor package includes a control transistor and a sync transistor of a power converter switching stage attached over a first...
US-9,831,147 Packaged semiconductor device with internal electrical connections to outer contacts
In an embodiment, an electronic component includes a first dielectric layer including an organic component having a decomposition temperature of at least...
US-9,831,127 Method of processing a semiconductor substrate and semiconductor chip
A method of processing a semiconductor substrate is provided. The method may include forming a film over a first side of a semiconductor substrate, forming at...
US-9,830,130 Random number generator
According to one embodiment, a random number generator is provided including an oscillator arrangement including a first oscillator and a second oscillator. The...
US-9,829,543 Sensor arrangement having thermo-EMF compensation
Sensor arrangement providing a signal responsive to a temperature difference between a Hall-effect device output contact and a reference point, having first...
US-9,829,387 System and method for temperature sensing
According to an embodiment, a method of operating a measurement circuit includes biasing a sense transistor to conduct current through a first conduction...
US-9,828,237 MEMS device and MEMS vacuum microphone
In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low...
US-9,825,361 Antenna with multifrequency capability for miniaturized applications
A circuit arrangement includes a first antenna configured to couple to an electromagnetic field from a first frequency band and a second antenna configured to...
US-9,825,170 Semiconductor device comprising a transistor array and a termination region and method of manufacturing such a...
A semiconductor device formed in a semiconductor substrate having a first main surface comprises a transistor array and a termination region. The transistor...
US-9,825,165 Charge-compensation device
A charge-compensation semiconductor device includes a semiconductor body having a first surface, a lateral edge delimiting the semiconductor body in a...
US-9,825,148 Semiconductor device comprising an isolation trench
A method of manufacturing a semiconductor device includes forming a transistor in a semiconductor substrate having a first main surface. The transistor is...
US-9,825,139 Semiconductor device and method
A semiconductor device includes a device region including a compound semiconductor material and a non-device region at least partially surrounding the device...
US-9,825,136 Semiconductor component and integrated circuit
A semiconductor component includes an element composed of a conductive material, which is arranged above a surface of a semiconductor substrate. The element...
US-9,825,131 Method of manufacturing semiconductor devices and semiconductor device containing oxygen-related thermal donors
A method of manufacturing a semiconductor device includes determining information that indicates an extrinsic dopant concentration and an intrinsic oxygen...
US-9,825,129 Transistor device
A transistor device includes: a first source region and a first drain region spaced apart from each other in a first direction of a semiconductor body; at least...
US-9,825,127 Super junction semiconductor device with field extension zones
A super junction semiconductor device includes an impurity layer of a first (conductivity) type formed in a semiconductor portion having first and second...
US-9,825,023 Insulated gate bipolar transistor comprising negative temperature coefficient thermistor
An embodiment of an IGBT comprises an emitter terminal at a first surface of a semiconductor body. The IGBT further comprises a collector terminal at a second...
US-9,824,983 Chip carrier, a device and a method
According to various embodiments, a chip carrier may include: a chip supporting region configured to support a chip; a chip contacting region including at least...
US-9,824,977 Semiconductor packages and methods of forming the same
In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate...
US-9,824,976 Single-sided power device package
In some examples, a circuit package further includes an insulating layer and a first transistor extending through the insulating layer, where the first...
US-9,824,972 Contacts for semiconductor devices and methods of forming thereof
A method for a method of forming a semiconductor device includes providing a semiconductor substrate having a bottom surface opposite a top surface with...
US-9,824,958 Chip carrier structure, chip package and method of manufacturing the same
Various embodiments provide a chip carrier structure. The chip carrier structure may include a structured metallic chip carrier; encapsulating material at least...
US-9,824,927 Methods for producing semiconductor devices
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first...
US-9,824,799 Measuring resistor and method for producing a measuring resistor
A measuring resistor for high-current measurements is provided, which has a defined resistance value. The measuring resistor has a resistive layer having a...
US-9,823,290 Method for testing components and measuring arrangement
In accordance with one embodiment, a method for testing a plurality of electronic components is provided, including subdividing the plurality of electronic...
US-9,823,168 Auto tire localization systems and methods utilizing a TPMS angular position index
Embodiments relate to tire localization systems and methods for tire pressure monitoring systems (TPMS). In embodiments, a tire pressure management system...
US-9,820,343 Light-emitting diode headlight driver
A driver circuit for light-emitting diode (LED) headlight system includes a buck-boost converter connected in series to a first plurality of branches of LEDs....
US-9,819,353 Apparatus and method for testing an analog-to-digital converter
A method for use in testing an analog-to-digital converter. The method includes providing a set of bins, varying a voltage, taking samples of the voltage,...
US-9,819,341 Semiconductor devices
A semiconductor device includes a first transistor cell of a plurality of transistor cells of a vertical field effect transistor arrangement, and a second...
US-9,819,339 Method and circuit for reducing collector-emitter voltage overshoot in an insulated gate bipolar transistor
A circuit for reducing collector-emitter voltage (V.sub.CE) overshoot in an insulated gate bipolar transistor (IGBT) is provided. The circuit includes circuitry...
US-9,819,259 System and method for a power conversion system
In accordance with an embodiment, a method of operating a power system includes operating a power converter at a first output power, monitoring a first input...
US-9,819,191 Maximum power point tracking for low power energy harvesting
A controller for controlling a power converter is described. The controller may include a current sensor and a pulse modulation device. The current sensor may...
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