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| Patent # | Description |
|---|---|
| US-9,998,812 |
Surface mountable microphone package, a microphone arrangement, a mobile
phone and a method for recording... A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a... |
| US-9,998,128 |
Frequency synthesizer with injection locked oscillator Representative implementations of devices and techniques provide reduced jitter for a controlled oscillator. An edge of a reference signal is injected at... |
| US-9,998,110 |
System and method for variable impedance gate driver In accordance with an embodiment, a circuit including: a gate driver coupled to a first supply terminal and to an output terminal, the output terminal... |
| US-9,998,080 |
Low voltage supply amplifier A circuit includes a differential input pair stage including bipolar transistors and configured to receive an RF input signal; a cascode stage coupled between... |
| US-9,998,076 |
Methods and circuitry to trim common mode transient control circuitry Embodiments herein include a replica communication path and monitor circuit to provide increased common mode transient immunity. As its name suggests, the... |
| US-9,998,020 |
Method and apparatus for efficient switching in semi-resonant power
converters A voltage converter includes a power stage, a passive circuit, a synchronous rectification (SR) switch component, and a control circuit. The passive circuit... |
| US-9,998,011 |
Phase current estimation for switching power converters A phase current estimator for a switching power converter includes analog circuitry for generating a phase current estimate error by comparing a phase current... |
| US-9,998,008 |
Active transient response for DC-DC converters A first power transistor of a DC-DC converter is connected between a voltage supply node and a common node, a second power transistor is connected between a... |
| US-9,997,608 |
Transistor device with segmented contact layer Disclosed is a transistor device. The transistor device includes a plurality of device cells each having an active device region integrated in a semiconductor... |
| US-9,997,602 |
Semiconductor device with transistor cells and enhancement cells with
delayed control signals A semiconductor device includes transistor cells and enhancement cells. Each transistor cell includes a body zone that forms a first pn junction with a drift... |
| US-9,997,595 |
Semiconductor device, a micro-electro-mechanical resonator and a method
for manufacturing a semiconductor device A semiconductor device includes a silicon substrate layer with a decoupling region. The decoupling region of the silicon substrate layer comprises an array of... |
| US-9,997,517 |
Power semiconductor device having fully depleted channel regions A power semiconductor device is disclosed. In one example, the device includes a semiconductor body coupled to a first load terminal structure and a second load... |
| US-9,997,515 |
Semiconductor devices with trench gate structures in a semiconductor body
with hexagonal crystal lattice A semiconductor device includes trench gate structures in a semiconductor body with hexagonal crystal lattice. A mean surface plane of a first surface is tilted... |
| US-9,997,476 |
Multi-die package having different types of semiconductor dies attached to
the same thermally conductive flange A multi-die package is manufactured by attaching a first semiconductor die made of a first semiconductor material to a thermally conductive flange via a first... |
| US-9,997,459 |
Semiconductor device having a barrier layer made of amorphous molybdenum
nitride and method for producing such... A semiconductor device includes a semiconductor body having a front face, a back face and an active zone at the front face. A front surface metallization layer... |
| US-9,997,443 |
Through vias and methods of formation thereof In accordance with an embodiment of the present invention, a semiconductor chip includes a device region disposed in or over a substrate, a doped region... |
| US-9,997,359 |
Semiconductor device with rear-side insert structure A semiconductor device includes a semiconductor body and a rear side insertion structure. The semiconductor body has a first surface at a front side and a... |
| US-9,995,793 |
System and method for a built-in-self-test of a battery According to an embodiment, a system includes a switching regulator and an electrochemical storage test circuit. The switching regulator is coupled to a power... |
| US-9,994,179 |
Circuit arrangements and a method for receiving information A circuit arrangement is provided, the circuit arrangement including a receiver configured to receive signal information from a sensor circuit; a discharge... |
| US-9,991,832 |
Detecting brushfire in power systems In some examples, a detection circuit is configured to detect a brushfire in a power system based on an electrical signal from the power system. The detection... |
| US-9,991,806 |
Voltage converter circuitry and methods implementing modulated feedback
signal Disclosed is a voltage converter and a method. The voltage converter includes: an input, an output, and a transformer including a primary winding and a... |
| US-9,991,791 |
System and method for a switched-mode power supply In accordance with an embodiment, a method of operating a switched-mode power converter includes measuring an input voltage of the switched-mode power... |
| US-9,991,609 |
Electrical connection module, semiconductor module and method for
producing a semiconductor module An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and... |
| US-9,991,377 |
Trench FET with ruggedness enhancement regions According to an exemplary implementation, a field-effect transistor (FET) includes first and second gate trenches extending to a drift region of a first... |
| US-9,991,373 |
Semiconductor device In an embodiment, a semiconductor device includes a substrate, a Group III nitride based transistor arranged on a front surface of the substrate, and a... |
| US-9,991,347 |
Semiconductor device having a cavity A power semiconductor device includes a semiconductor substrate having a drift region, a gate electrode trench in the semiconductor substrate and a field... |
| US-9,991,340 |
Mechanical stress-decoupling in semiconductor device According to a method in semiconductor device fabrication, a first trench and a second trench are concurrently etched in a semi-finished semiconductor device.... |
| US-9,991,252 |
Semiconductor device comprising electrostatic discharge protection
structure A semiconductor device includes a semiconductor body having first and second opposing surfaces, a first isolation layer on the first surface of the... |
| US-9,991,183 |
Semiconductor component having inner and outer semiconductor component
housings A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component... |
| US-9,989,630 |
Structured-light based multipath cancellation in ToF imaging Representative implementations of devices and techniques provide multipath interference cancelling for imaging devices and systems. In various implementations,... |
| US-9,989,574 |
System and method for short-circuit detection in load chains An embodiment method for short-circuit detection includes determining a set of local reference voltages each associated with a respective load chain in a... |
| US-9,988,262 |
Temporary mechanical stabilization of semiconductor cavities A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of... |
| US-9,987,830 |
Method for processing a carrier and method for transferring a graphene
layer According to various embodiments, a method for processing a carrier may include: forming a layer structure over the carrier, the layer structure including a... |
| US-9,986,354 |
Pre-mold for a microphone assembly and method of producing the same A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially... |
| US-9,986,344 |
MEMS microphone with low pressure region between diaphragm and counter
electrode A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter... |
| US-9,985,639 |
Detection and mitigation of non-linearity of phase interpolator Representative implementations of devices and techniques provide non-linearity detection and mitigation for a phase interpolator of a controlled oscillator... |
| US-9,985,126 |
Semiconductor device comprising a first gate electrode and a second gate
electrode A semiconductor device includes a transistor. The transistor includes a source region and a drain region disposed adjacent to a first main surface of a... |
| US-9,985,017 |
Semiconductor device comprising a clamping structure Semiconductor device with a semiconductor body that includes a clamping structure including a pn junction diode and a Schottky junction diode serially connected... |
| US-9,984,930 |
Method for processing a carrier A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent... |
| US-9,984,928 |
Method for producing a number of chip assemblies and method for producing
a semiconductor arrangement Method for producing chip assemblies that include semiconductor chip arrangements, each semiconductor chip arrangement including a semiconductor chip having a... |
| US-9,984,927 |
Method and apparatus for separating semiconductor devices from a wafer An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor... |
| US-9,984,917 |
Semiconductor device with an interconnect and a method for manufacturing
thereof A method for manufacturing a semiconductor device in accordance with various embodiments may include: forming an opening in a first region of a semiconductor... |
| US-9,984,915 |
Semiconductor wafer and method for processing a semiconductor wafer According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one... |
| US-9,984,900 |
Semiconductor device including at least one element A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element,... |
| US-9,984,897 |
Method for manufacturing a chip arrangement including a ceramic layer A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the... |
| US-9,984,691 |
System for a transducer system with wakeup detection According to embodiments described herein, a circuit includes an interface circuit configured to be coupled to a transducer and a detection circuit. The... |
| US-9,982,989 |
Angle sensors, systems and methods Embodiments relate to magnetic field angle sensors, including off-axis and on-axis sensors. In an embodiment, a magnetic field angle sensor comprises two sensor... |
| US-9,981,844 |
Method of manufacturing semiconductor device with glass pieces A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material.... |
| US-9,981,843 |
Chip package and a method of producing the same A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of... |
| US-9,979,187 |
Power device with overvoltage arrester An example power device includes a semiconductor chip and an arrester element configurable to, in response to a voltage across the arrester element being... |
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