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| Patent # | Description |
|---|---|
| US-1,005,0649 |
Communication devices and methods Devices and methods are provided where a first signal is provided via an interface, and a second signal is provided related to the suitability of the first... |
| US-1,005,0530 |
Method and apparatus for control adaptation in resonant-tapped inductor
converters A semi-resonant voltage converter has a synchronous rectification (SR) switch through which a half-cycle sinusoidal-like current is conducted when turned on. An... |
| US-1,005,0528 |
Current distribution in DC-DC converters A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active... |
| US-1,005,0443 |
PFC controller add-on circuit to stabilize THDi performance A total harmonic distortion (THDi) reduction circuit for a power factor correction (PFC) controller to control a PFC stage. The THDi reduction circuit... |
| US-1,005,0316 |
Communication between battery cells A system includes a battery and a plurality of integrated circuits. The battery includes a plurality of battery cells. Each integrated circuit of the plurality... |
| US-1,005,0139 |
Semiconductor device including a LDMOS transistor and method In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a LDMOS transistor in the front surface, and a metallization... |
| US-1,005,0113 |
Semiconductor device with needle-shaped field plates and a gate structure
with edge and node portions A semiconductor device includes needle-shaped field plate structures extending from a first surface into transistor sections of a semiconductor portion in a... |
| US-1,004,9994 |
Contact pads with sidewall spacers and method of making contact pads with
sidewall spacers A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads... |
| US-1,004,9962 |
Arrangement of multiple power semiconductor chips and method of
manufacturing the same A semiconductor power arrangement includes a chip carrier having a first surface and a second surface opposite the first surface. The semiconductor power... |
| US-1,004,9914 |
Method for thinning substrates According to various embodiments, a method may include: providing a substrate having a first side and a second side opposite the first side; forming a buried... |
| US-1,004,9912 |
Method of manufacturing a semiconductor device having a vertical edge
termination structure A method of manufacturing a semiconductor device includes forming a frame trench extending from a first surface into a base substrate, forming, in the frame... |
| US-1,004,9879 |
Self aligned silicon carbide contact formation using protective layer A silicon-carbide substrate that includes: a doped silicon-carbide contact region directly adjoining a main surface of the substrate, and a dielectric layer... |
| US-1,004,9072 |
Method and apparatus for use in a data processing system A method is described, for use in a data processing system, the system having a node and a communication link, wherein the communication link is coupled to the... |
| US-1,004,8328 |
Redundant magnetic angle sensor with improved accuracy An angle sensor may comprise a first primary sensing element and a second primary sensing element. The first primary sensing element may be positioned adjacent... |
| US-1,004,8327 |
Sensor with micro break compensation A sensor device includes a high voltage circuit, a sensor and a charge storage. The sensor utilizes a low voltage supply. The high voltage circuit includes a... |
| US-1,004,8297 |
Method and apparatus for measuring a disturbed variable Provided are apparatuses and methods, in which a disturbed measurement variable is converted to a digital signal. The digital signal is then averaged over a... |
| US-1,004,8296 |
Detection of current change in an integrated circuit An embodiment relates to an integrated circuit comprising measurement means for detection of a current change, wherein said measurement means comprise at least... |
| US-1,004,8091 |
Magnetic multimedia control element A magnetic sensor may include a set of elements to detect a set of magnetic field strengths of a magnetic field generated by a magnet, and determine, based on... |
| US-1,004,4005 |
Electrode, an electronic device, and a method for manufacturing an
optoelectronic device According to various embodiments, an electrode may include at least one layer including a chemical compound including aluminum and titanium. |
| US-1,004,3866 |
Semiconductor device and a method for forming a semiconductor device A method for forming a semiconductor device includes forming an oxide layer on a semiconductor substrate. A first portion of the oxide layer forms a gate oxide... |
| US-1,004,3782 |
Electronic device package having a dielectric layer and an encapsulant A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip... |
| US-1,004,3768 |
Semiconductor device and method of manufacture thereof A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a... |
| US-1,004,3750 |
Nanotube structure based metal damascene process In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups... |
| US-1,004,3701 |
Substrate removal from a carrier Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is... |
| US-1,004,3683 |
Plasma system, chuck and method of making a semiconductor device A chuck, a system including a chuck and a method for making a semiconductor device are disclosed. In one embodiment the chuck includes a first conductive region... |
| US-1,004,3640 |
Process tools and methods of forming devices using process tools In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber.... |
| US-1,004,3126 |
Chip card module, chip card and method of forming a chip card module In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second... |
| US-1,004,2807 |
Differential bus receiver with four-quadrant input circuit Systems, devices, methods, and techniques for bus receivers operable to provide a data output corresponding to a voltage differential provided on a... |
| US-1,004,2738 |
Lightweight trace based measurement systems and methods An automotive electronics system includes an electronic control unit and a trace adapter. The electronic control unit is configured to receive measurement... |
| US-1,004,2693 |
Diverse integrated processing using processors and diverse firmware Fault detection devices, systems and methods are provided which implement identical processors. A first processor is configured to receive a first measurement,... |
| US-1,004,2002 |
System and method for contact measurement circuit According to an embodiment, a contact measurement circuit is configured to be coupled between a first contact and a second contact, and the contact measurement... |
| US-1,004,1979 |
Method of sensing current flowing in a power module A method of sensing current flowing in a power module is provided. The module includes a first substrate having a metallized side, a second substrate spaced... |
| US-1,004,1973 |
Method and apparatus for dynamic alignment of semiconductor devices A semiconductor device is aligned by placing the semiconductor device in a nest between first and second sections of the nest when the nest is in a receiving... |
| US-1,004,1839 |
Thermal observer and overload protection for power switches The present disclosure proposes the placing of temperature sensors embedded in the power semiconductor device. In this, at least one of the embedded temperature... |
| US-1,003,8404 |
Adaptive biasing control for radio frequency power amplifiers Techniques are provided for adapting a bias provided to a radio frequency (RF) power amplifier (PA), so as to achieve linear operation over a wide range of... |
| US-1,003,8105 |
Semiconductor devices, a semiconductor diode and a method for forming a
semiconductor device A semiconductor device includes at least one highly doped region of an electrical device arrangement formed in a semiconductor substrate and a contact structure... |
| US-1,003,8087 |
Semiconductor device and transistor cell having a diode region According to an embodiment of a semiconductor device, the device includes a semiconductor body with a drift region and neighboring device cells integrated in... |
| US-1,003,8085 |
High electron mobility transistor with carrier injection mitigation gate
structure A method includes providing a heterostructure body with a buffer region, and a barrier region disposed on the buffer region, and forming a gate structure for... |
| US-1,003,8052 |
Semiconductor device with channelstopper and method for producing the same A vertical semiconductor device comprises a substrate having a front surface and a back surface, an active area (AA) located in the substrate, having a drift... |
| US-1,003,8051 |
Vertical potential short in the periphery region of a III-nitride stack
for preventing lateral leakage A semiconductor die includes a substrate and a semiconductor body supported by the substrate and having a periphery which is devoid of active devices and... |
| US-1,003,7972 |
Electronic module comprising fluid cooling channel and method of
manufacturing the same Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an... |
| US-1,003,7934 |
Semiconductor chip package having contact pins at short side edges A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact... |
| US-1,003,7887 |
Method for implanting ions into a semiconductor substrate and an
implantation system A method for implanting ions into a semiconductor substrate includes performing a test implantation of ions into a semiconductor substrate. The ions of the test... |
| US-1,003,7068 |
Configurable digital interface for switching voltage regulators A high-speed, low-latency configurable digital interface for a voltage regulator includes a first hardwired unit, a second hardwired unit and a programmable... |
| US-1,003,6771 |
Circuit arrangement According to various embodiments, a circuit arrangement is provided which includes a bridge circuit having at least two field effect transistors and a... |
| US-1,003,4258 |
Signal detector device and method A signal detector device and method includes a quadrature demodulator configured to receive an input signal, a first reference signal, and a second reference... |
| US-1,003,4100 |
Sound transducer structure and method for manufacturing a sound transducer
structure A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a... |
| US-1,003,4089 |
Sensor arrangement having an optimized group delay and signal processing
method In various embodiments, a circuit arrangement is provided. The circuit arrangement includes a sensor set up to provide an analogue signal, an analogue/digital... |
| US-1,003,3370 |
Circuit and method for driving a power semiconductor switch A drive circuit for driving a semiconductor switch includes an overload detector circuit connected to the semiconductor switch and designed to detect an... |
| US-1,003,3297 |
Rectifier device A rectifier is described herein. According to one example, the rectifier includes a semiconductor substrate and further includes an anode terminal and a cathode... |
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