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| Patent # | Description |
|---|---|
| US-1,010,4812 |
Elastic mounting of power modules A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a... |
| US-1,010,3724 |
Dimension regulation of power device to eliminate hot spot generation A parameter is compared to a lower threshold. The parameter is a gate-to-source voltage that is associated with a first transistor or a drain current that is... |
| US-1,010,3638 |
Flyback converter with capacitor module and switching module In an example, a circuit for voltage regulation includes a capacitor module, a multiple winding transformer, and a switching module. The capacitor module... |
| US-1,010,3227 |
Method for manufacturing a power semiconductor device A method for manufacturing a power semiconductor device includes: forming a drift region of a first conductivity type, a second emitter region of a second... |
| US-1,010,3123 |
Semiconductor devices and processing methods Various embodiments provide a semiconductor device, including a final metal layer having a top side and at least one sidewall; and a passivation layer disposed... |
| US-1,010,3076 |
Semiconductor package including a semiconductor die having redistributed
pads A method includes coupling a first major surface of a semiconductor die to a metallic body, depositing an insulation body over said semiconductor die, and... |
| US-1,010,3050 |
System reference with compensation of electrical and mechanical stress and
life-time drift effects Stress compensated systems and methods of compensating for electrical and mechanical stress are discussed. One example system can include a first circuit and a... |
| US-1,010,2992 |
Switching apparatus, switching system and switching method The present disclosure relates to a switching device, comprising an input for a sensor signal, the sensor signal having a sensor signal amplitude; and... |
| US-1,010,2967 |
Method of manufacturing an inductor core for a chip assembly and chip
assembly A method for manufacturing an inductor core is developed, wherein the method comprises the following: Forming a first electrical conductor on a first surface of... |
| US-1,010,1453 |
Time of flight apparatuses and an illumination source An apparatus includes a detector circuit configured to receive a modulated electromagnetic wave signal from an illumination source and to provide a detection... |
| US-1,010,1379 |
Sensor self-diagnostics using multiple signal paths Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and... |
| US-1,009,9519 |
Systems and methods using a reference marker A tire pressure monitor sensor is disclosed. The sensor includes a wireless transmitter and a processing unit. The processing unit provides a time trigger... |
| US-1,009,9411 |
Method and apparatus for simultaneously encapsulating semiconductor dies
with layered lead frame strips A mold injection tool includes a first mold plate having first and second columns of mold cavities, each of the cavities and a first cull block arranged between... |
| US-1,009,7918 |
Chip arrangement and a method for manufacturing the same In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip... |
| US-1,009,7115 |
Auto-synchronization of brushless DC motors A controller for controlling a multiphase brushless direct current (BLDC) motor is described. The controller may be configured to determine that the multiphase... |
| US-1,009,7010 |
Control of freewheeling voltage In one example, a circuit includes a voltage source, an inductive load, a capacitor, a switching unit, and a load unit. The switching unit is configured to... |
| US-1,009,6902 |
Antenna arrangement, communication appliance and antenna structure In various embodiments, an antenna arrangement is provided. The antenna arrangement may include at least one integrated circuit; at least one loop antenna that... |
| US-1,009,6705 |
Integrated high side gate driver structure and circuit for driving high
side power transistors An integrated high side gate driver structure for driving a power transistor. The structure includes a semiconductor substrate having a first polarity... |
| US-1,009,6704 |
Semiconductor device having a non-depletable doping region A semiconductor device includes a plurality of compensation regions of a vertical electrical element arrangement, a plurality of drift regions of the vertical... |
| US-1,009,6701 |
Gallium nitride materials and methods associated with the same Semiconductor materials including a gallium nitride material region and methods associated with such structures are provided. The semiconductor structures... |
| US-1,009,6677 |
Methods for forming a semiconductor device and a semiconductor device A method for forming a semiconductor device includes implanting a predefined dose of protons into a semiconductor substrate. Further, the method comprises... |
| US-1,009,6584 |
Method for producing a power semiconductor module In order to produce a power semiconductor module, a circuit carrier is populated with a semiconductor chip and with an electrically conductive contact element.... |
| US-1,009,6531 |
Semiconductor device with sensor potential in the active region A semiconductor device includes semiconductor body region and a surface region, the semiconductor body region including a first conductivity type first... |
| US-1,009,6511 |
Carrier and a method for processing a carrier According to various embodiments, a carrier may be provided, the carrier including: a hollow chamber spaced apart from a surface of the carrier; a trench... |
| US-1,009,6508 |
Assembly for handling a semiconductor die and method of handling a
semiconductor die In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also... |
| US-1,009,6507 |
Thin substrate electrostatic chuck system and method In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate... |
| US-1,009,5301 |
Interconnect serialization system and method A method and system to reduce power consumption are described. The system can include a first device and a second device of a plurality of devices. The second... |
| US-1,009,4913 |
Radar circuit, radar system and method for testing A radar circuit for controlling a radar antenna in a vehicle comprises an antenna connection for connection of a radar antenna, a radar circuit for transmission... |
| US-1,009,4889 |
Systems and arrangements of three-contact hall-effect devices and related
methods Embodiments relate to vertical Hall effect devices comprising Hall effect structures with three contacts in each Hall effect region. In one embodiment, the... |
| US-1,009,3137 |
Wheel localizer, wheel localization device, system, method and computer
program for locating a position of a wheel Embodiments provide a device, a system, a method and a computer program for locating a plurality of positions of a plurality of wheels on a vehicle. The device... |
| US-1,009,2974 |
Method for producing a circuit carrier and for connecting an electrical
conductor to a metallization layer of a... One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an... |
| US-1,009,0406 |
Non-planar normally off compound semiconductor device A normally-off compound semiconductor device includes a first III-nitride semiconductor having a first sloped transition region in which the first III-nitride... |
| US-1,009,0265 |
Semiconductor device with metal structure electrically connected to a
conductive structure A semiconductor device includes a semiconductor die that having a conductive structure. A metal structure is electrically connected to the conductive structure... |
| US-1,009,0251 |
Semiconductor chip having a dense arrangement of contact terminals A semiconductor chip includes a semiconductor body having an active device region, one or more metallization layers insulated from the semiconductor body and... |
| US-1,009,0216 |
Semiconductor package with interlocked connection A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an... |
| US-1,009,0215 |
System and method for dual-region singulation A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the... |
| US-1,009,0214 |
Wafer and method for processing a wafer A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation... |
| US-1,009,0192 |
Method for producing a conductor line A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is... |
| US-1,008,9430 |
Integrated circuits and methods of design and manufacture thereof Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a... |
| US-1,008,8855 |
Corrected temperature sensor measurement Representative implementations of devices and techniques provide correction for temperature sensor measurement error. In an example, the temperature sensor... |
| US-1,008,7872 |
System and method for a synchronized driver circuit According to an embodiment, a controller system that is configured to drive a power switch includes a driver integrated circuit (IC), which includes an... |
| US-1,008,7866 |
Detecting fuel injector timing with current sensing A fuel injection system for an internal combustion engine includes a fuel injector and an engine control system. The engine control system is configured to send... |
| US-1,008,6370 |
Microfluidic device and method A microfluidic device includes a semiconductor chip having a main chip surface. The microfluidic device further includes an encapsulation body embedding the... |
| US-1,008,5353 |
Solder bridging prevention structures for circuit boards and semiconductor
packages A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically... |
| US-1,008,5314 |
Light emitting diode driver for load changes A device for regulating a voltage includes a first branch switch, a second branch switch, and a control module. The control module is configured to determine an... |
| US-1,008,3835 |
Forming electrode trenches by using a directed ion beam and semiconductor
device with trench electrode structures By directing an ion beam with a beam divergence .theta. on a process surface of a semiconductor substrate, parallel electrode trenches are formed in the... |
| US-1,008,2484 |
Gas-sensitive hall device A chemically sensitive Hall device is described herein. In accordance with one example of the present invention, a Hall device comprises a substrate and a... |
| US-1,008,1533 |
Micromechanical structure and method for fabricating the same A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region... |
| US-1,007,9650 |
Robust high speed sensor interface for remote sensors Systems, methods, and apparatuses are discussed that enable robust, high-speed communication of sensor data. One example system includes a sensor bus, an... |
| US-1,007,9610 |
Built-in self-test for ADC Representative implementations of devices and techniques provide a built-in self-test (BIST) for an analog-to-digital converter (ADC). Stimuli needed to test an... |
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