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| Patent # | Description |
|---|---|
| US-9,714,988 |
Hall effect sensor with graphene detection layer A Hall Effect sensor with a graphene detection layer implemented in a variety of geometries, including the possibility of a so-called "full 3-d" Hall sensor,... |
| US-9,708,182 |
Methods for producing a cavity within a semiconductor substrate A method for producing at least one cavity within a semiconductor substrate includes dry etching the semiconductor substrate from a surface of the semiconductor... |
| US-9,708,180 |
MEMS device with polymer layer, system of a MEMS device with a polymer
layer, method of making a MEMS device... A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS... |
| US-9,704,913 |
Manufacturing of an imager device and imager device Embodiments related to the manufacturing of an imager device and an imager device are disclosed. Embodiments associated with methods of an imager device are... |
| US-9,704,750 |
Method for forming a semiconductor device and a semiconductor device A method of forming a semiconductor device and a semiconductor device are provided. The method includes providing a wafer stack including a carrier wafer... |
| US-9,698,833 |
Voltage standing wave radio measurement and tuning systems and methods A standing wave ratio detection arrangement is disclosed. The arrangement includes a standing wave ratio detector and a controller. The standing wave ratio... |
| US-9,698,683 |
Method and apparatus for controller optimization of a switching voltage
regulator Control loop coefficients for a digital voltage regulator controller are determined by determining PID (proportional-integral-derivative) coefficients that... |
| US-9,698,083 |
Three-dimensional stack of leaded package and electronic member An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier... |
| US-9,692,623 |
Receiver, transmitter, method for determining a value encoded in a PWM
signal, and method for transmitting a... A receiver includes a receiver circuit to receive a pulse width modulated signal, which assumes a first signal level, a second signal level and an intermediate... |
| US-9,691,885 |
Method for manufacturing a transistor A method comprises arranging a stack, on a semiconductor substrate, comprising a sacrificial layer and an insulating layer. The insulator layer is at least... |
| US-9,689,770 |
Selfcalibration of capacitive pressure sensors with electrostatic forces A pressure sensor calibration system comprises one or more pressures sensors for calibrating sensor parameters based on a membrane deflection or a membrane... |
| US-9,688,060 |
Method for producing a composite and a power semiconductor module A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a... |
| US-9,685,967 |
Chopper stabilized sigma delta ADC A .SIGMA..DELTA. ADC includes a forward path, a feedback path, and offset compensation circuitry. The forward path is configured to convert an analog input... |
| US-9,685,923 |
Communication over a voltage isolation barrier A transmitter circuit comprises: an input, an encoder circuit, and a transmitter. During operation, the transmitter circuit receives an input signal. The... |
| US-9,685,506 |
IGBT having an inter-trench superjunction structure There are disclosed herein implementations of an insulated-gate bipolar transistor (IGBT) having an inter-trench superjunction structure. Such an IGBT includes... |
| US-9,683,306 |
Method of forming a composite material and apparatus for forming a
composite material A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension... |
| US-9,680,005 |
Semiconductor device having an active trench and a body trench A semiconductor substrate having a first main surface and a transistor cell includes a drift region, a body region between the drift region and the first main... |
| US-9,680,004 |
Power MOSFET with seperate gate and field plate trenches A power MOSFET includes a gate electrode in a gate trench in a main surface of a semiconductor substrate, the gate trench extending parallel to the main... |
| US-9,679,963 |
Semiconductor structure and a method for processing a carrier According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed... |
| US-9,679,892 |
Method of manufacturing a reverse blocking semiconductor device A reverse blocking semiconductor device is manufactured by introducing impurities of a first conductivity type into a semiconductor substrate of the first... |
| US-9,679,856 |
System and method for a microfabricated fracture test structure According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a... |
| US-9,679,167 |
Chip and method for detecting an attack on a chip According to one embodiment, a chip is described comprising a substrate; an energy source configured to provide energy to the substrate; an energy receiver... |
| US-9,678,168 |
Sensor system including multiple comparators A system including a sensor circuit and comparison circuitry. The sensor circuit is configured to provide a sensed signal. The comparison circuitry is... |
| US-9,672,182 |
High-speed serial ring Methods and systems for transferring a high-speed data signal between more than two electronic devices within a system comprising a master device and a... |
| US-9,670,059 |
Sensor structure for sensing pressure waves and ambient pressure In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive... |
| US-9,670,057 |
Sensor device and method for making thereof A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with... |
| US-9,668,056 |
Sound transducer structure and method for manufacturing a sound transducer
structure A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a... |
| US-9,667,409 |
Sensor that transmits signals responsive to a request signal and receives
information A sensor comprises a transmitter to transmit signals over a communication path, the sensor further capable to receive signals from the communication path,... |
| US-9,667,357 |
Millimeter-wave transmitter on a chip, method of calibration thereof and
millimeter-wave power sensor on a chip The present invention relates to a millimeter-wave transmitter on a chip comprising at least one transmit path coupleable to an oscillator, and an on-chip power... |
| US-9,667,243 |
High speed tracking current sense system A tracking current sensing system is described. The system may include a first electrical sensing element configured to receive a first electrical signal and a... |
| US-9,666,705 |
Contact structures for compound semiconductor devices A semiconductor device includes a semiconductor body including a plurality of compound semiconductor layers and a two-dimensional charge carrier gas channel... |
| US-9,666,696 |
Method of manufacturing a vertical junction field effect transistor A method of manufacturing a vertical junction field effect transistor (JFET) includes forming a drain in a semiconductor substrate, forming a compound... |
| US-9,666,663 |
Semiconductor device with cell trench structures and contacts and method
of manufacturing a semiconductor device First and second cell trench structures extend from a first surface into a semiconductor substrate. The first cell trench structure includes a first buried... |
| US-9,666,557 |
Small footprint semiconductor package A semiconductor assembly includes a substrate with electrically conductive regions and a semiconductor package. The semiconductor package includes a... |
| US-9,666,543 |
Electronic system An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an... |
| US-9,666,482 |
Self aligned silicon carbide contact formation using protective layer A silicon-carbide substrate that includes a doped contact region and a dielectric layer is provided. A protective layer is formed on the dielectric layer. A... |
| US-9,666,452 |
Chip packages and methods for manufacturing a chip package A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the... |
| US-9,664,728 |
Detection of defective electrical connections An embodiment relates to an integrated circuit comprising at least two electrical connections and at least one coil arranged adjacent to at least one of the... |
| US-9,664,178 |
Circuits, systems and methods for integrating sensing and heating
functions Embodiments relate to integrated circuits, systems and methods for combined sensing and heating functions in structures suitable for use in deicing, heating and... |
| US-9,663,355 |
Method and structure for creating cavities with extreme aspect ratios Embodiments relate to structures, systems and methods for more efficiently and effectively etching sacrificial and other layers in substrates and other... |
| US-9,663,354 |
Mechanical stress-decoupling in semiconductor device According to a method in semiconductor device fabrication, a first trench and a second trench are concurrently etched in a semi-finished semiconductor device.... |
| US-9,660,029 |
Semiconductor device having a positive temperature coefficient structure A semiconductor device includes a first load terminal at a first surface of a semiconductor body and a second load terminal at the opposing surface. An active... |
| US-9,659,657 |
Reuse of electrical charge at a semiconductor memory device A semiconductor memory device having a plurality of decoders, wherein each decoder is assigned to a select line, wherein no other decoder is assigned to the... |
| US-9,658,974 |
System and method for processing device with differentiated execution mode In accordance with an embodiment of the present invention, a method of operating a system includes operating in a first operating mode to not permit access to... |
| US-9,653,996 |
Adaptive off time control scheme for semi-resonant and hybrid converters In one implementation, a voltage converter includes a high side power switch, and first and second low side power switches. The voltage converter also includes... |
| US-9,653,671 |
Light emitting device and method for operating a plurality of light
emitting arrangements According to various examples, systems, methods, and devices for a light emitting device are described herein. As one example, a light emitting device includes... |
| US-9,653,405 |
Chip arrangement and a method of manufacturing a chip arrangement In various embodiments, a chip arrangement may be provided. The chip arrangement may include a metallic carrier. The chip arrangement may also include at least... |
| US-9,653,386 |
Compact multi-die power semiconductor package One disclosed implementation is a power semiconductor package including a sync transistor having a drain on its top surface and a source and a gate on its... |
| US-9,653,370 |
Systems and methods for embedding devices in printed circuit board
structures Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a... |
| US-9,652,011 |
Systems and methods for storing information Embodiments relate to multi-contact sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can... |
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