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Patent # Description
US-9,820,343 Light-emitting diode headlight driver
A driver circuit for light-emitting diode (LED) headlight system includes a buck-boost converter connected in series to a first plurality of branches of LEDs....
US-9,819,353 Apparatus and method for testing an analog-to-digital converter
A method for use in testing an analog-to-digital converter. The method includes providing a set of bins, varying a voltage, taking samples of the voltage,...
US-9,819,341 Semiconductor devices
A semiconductor device includes a first transistor cell of a plurality of transistor cells of a vertical field effect transistor arrangement, and a second...
US-9,819,339 Method and circuit for reducing collector-emitter voltage overshoot in an insulated gate bipolar transistor
A circuit for reducing collector-emitter voltage (V.sub.CE) overshoot in an insulated gate bipolar transistor (IGBT) is provided. The circuit includes circuitry...
US-9,819,259 System and method for a power conversion system
In accordance with an embodiment, a method of operating a power system includes operating a power converter at a first output power, monitoring a first input...
US-9,819,191 Maximum power point tracking for low power energy harvesting
A controller for controlling a power converter is described. The controller may include a current sensor and a pulse modulation device. The current sensor may...
US-9,818,934 Hall effect device
A hall effect device includes an active Hall region in a semiconductor substrate, and at least four terminal structures, each terminal structure including a...
US-9,818,827 Field plate trench semiconductor device with planar gate
A semiconductor device includes first and second load contacts and a semiconductor region extending along an extension direction. A surface region is arranged...
US-9,818,818 Power semiconductor device including trench gate structures with longitudinal axes tilted to a main crystal...
A semiconductor device includes a semiconductor body with a first main crystal direction parallel to a horizontal plane. Longitudinal axes of trench gate...
US-9,818,743 Power semiconductor device with contiguous gate trenches and offset source trenches
Disclosed is a power semiconductor device that includes a plurality of source trenches and adjacent source regions. The plurality of source trenches extend from...
US-9,818,730 Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a...
A semiconductor arrangement includes top and bottom contact plates, a plurality of chip assemblies, a dielectric embedding compound, and a control electrode...
US-9,818,665 Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled...
In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the...
US-9,818,602 Method of depositing a resin material on a semiconductor body with an inkjet process
A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of...
US-9,818,492 Method for testing a memory and memory system
A method for testing a memory includes performing an error correction code check (ECC check) on user data stored in the memory, inverting the user data stored...
US-9,817,782 System and method for a bus interface
In accordance with an embodiment, a method of operating a bus interface circuit includes detecting a start sequence on a plurality of input terminals,...
US-9,817,381 Sensor interface with variable control coefficients
The present disclosure is directed towards a sensor interface module that delivers a supply voltage to a plurality of sensors, and which exchanges data signals...
US-9,817,085 Frequency doubling of xMR signals
Embodiments relate to sensors, such as speed sensors and angle sensors, that use a modulated supply voltage to approximately double output signals of the...
US-9,817,079 Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an...
A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound...
US-9,816,881 Single diaphragm transducer structure
A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in...
US-9,816,838 Magnetoresistive angle sensor with linear sensor elements
A magnetic sensor may comprise a first linear output sensing element configured to sense a first component of an external magnetic field associated with a first...
US-9,812,979 Estimation of transformer leakage inductance and associated delay in voltage converters
A time delay through a voltage converter, including a transformer therein, must be known or estimated in order to optimally control the voltage converter. For...
US-9,812,971 Transformer flux estimation and limiting in isolated DC-DC voltage converters
A switching voltage converter using an isolated topology includes a transformer for coupling power from an input source to an output load. The transformer must...
US-9,812,636 Integrated circuit including sensor having injection molded magnetic material
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
US-9,812,563 Transistor with field electrodes and improved avalanche breakdown behavior
A transistor cell includes, in a semiconductor body, a drift region of a first doping type, a source region of the first doping type, a body region of a second...
US-9,812,538 Buried bus and related method
A semiconductor structure includes a semiconductor substrate having a gate electrode in a gate trench, a buried bus in the semiconductor substrate, the buried...
US-9,812,535 Method for manufacturing a semiconductor device and power semiconductor device
A method for manufacturing a semiconductor device includes: providing a semiconductor substrate having a first side; forming a trench in the semiconductor...
US-9,812,523 Capacitance structure
A capacitance structure includes a first input terminal configured to input a first input signal, a first output terminal configured to output the first output...
US-9,812,496 Magnetoresistive sensor module and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
US-9,812,438 Avalanche diode having an enhanced defect concentration level and method of making the same
The invention relates to an avalanche diode that can be employed as an ESD protection device. An avalanche ignition region is formed at the p-n junction of the...
US-9,812,383 Power converter package using driver IC
A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control...
US-9,812,376 Electrically conductive element, power semiconductor device having an electrically conductive element and...
An electrically conductive element includes an electrically conductive material and a plurality of inclusions of a phase change material. The phase change...
US-9,812,373 Semiconductor package with top side cooling heat sink thermal pathway
An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the...
US-9,812,369 BiMOS device with a fully self-aligned emitter-silicon and method for manufacturing the same
A method comprises providing a substrate of a first conductive type and a layer stack arranged on the substrate. The layer stack comprises a first isolation...
US-9,811,695 Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip...
In various embodiments, a chip card arrangement for carrying out contactless interaction with an external apparatus is provided. The chip card arrangement may...
US-9,809,877 Ion implantation apparatus with ion beam directing unit
An ion implantation apparatus includes an ion beam directing unit, a substrate support, and a controller. The controller is configured to effect a relative...
US-9,809,444 System and method for a differential comb drive MEMS
According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure...
US-9,806,881 Cryptographic processor, method for implementing a cryptographic processor and key generation circuit
A cryptographic processor is described comprising a processing circuit configured to perform a round function of an iterated cryptographic algorithm, a...
US-9,806,687 System and method for signal amplification using a resistance network
A signal amplification method includes receiving, from a capacitive sensor, a first input signal by a first control terminal of a first transistor, and a second...
US-9,806,621 Method and apparatus for phase alignment in semi-resonant power converters
Each phase of a multi-phase voltage converter includes a power stage, passive circuit, synchronous rectification (SR) switch, and control circuit. Each passive...
US-9,806,188 Method for producing a controllable semiconductor component having trenches with different widths and depths
A controllable semiconductor component is produced by providing a semiconductor body with a top side and a bottom side, and forming a first trench protruding...
US-9,806,187 Method for manufacturing a semiconductor device
A method for forming a semiconductor device is provided. The method includes providing a semiconductor body with a horizontal surface. An epitaxy hard mask is...
US-9,806,056 Method of packaging integrated circuits
Integrated circuits are packaged by placing a plurality of semiconductor dies on a support substrate, each one of the semiconductor dies having a plurality of...
US-9,806,043 Method of manufacturing molded semiconductor packages having an optical inspection feature
A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main...
US-9,806,041 Method for processing an electronic component and an electronic component
According to various embodiments, a method for processing an electronic component including at least one electrically conductive contact region may include:...
US-9,806,029 Transistor arrangement with semiconductor chips between two substrates
An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface...
US-9,806,008 Clip based semiconductor package for increasing exposed leads
A semiconductor package includes a leadframe having a clip foot portion, the clip foot portion having a first tie bar, a conductive clip situated over the...
US-9,805,771 Determining a state of a cell structure
A method is suggested for determining a state of a cell structure, wherein the cell structure includes several memory cells, the method includes: (i) detecting...
US-9,805,525 Apparatus and a method for providing an error signal for a control unit
An apparatus for providing an error signal for a control unit, the error signal indicating a malfunction of a sensor unit. The apparatus includes an input...
US-9,800,252 Methods and devices for storing parameters
Methods and devices are provided in which a first parameter partial value (p1) is stored in a first memory (12) and a second parameter partial value (p2) is...
US-9,800,236 Integrated analog delay line of a pulse-width modulator
A pulse width modulation (PWM) system comprises an analog component and a digital component. The analog component introduces an offset (i.e., a time delay) to...
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