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Patent # Description
US-9,948,876 Charge conservation in pixels
Representative implementations of devices and techniques provide conservation of charge in a pixel. Charge in the pixel may be alternately stored in a first...
US-9,948,409 Phase and amplitude signal sensing circuit for radio frequency (RF) transmitters
A radio frequency (RF) transmitter for self-sensing power and phase of an RF signal is provided. A local oscillator (LO) is configured to generate a LO signal....
US-9,948,289 System and method for a gate driver
In accordance with an embodiment, method of controlling a switching transistor includes applying a first voltage to a first node of a switchable tank circuit,...
US-9,948,187 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes turning on a semiconductor switch coupled to a primary winding of...
US-9,947,985 System and method for a directional coupler
In accordance with an embodiment, a method of operating a directional coupler includes determining a coupled power variation by applying an input signal at an...
US-9,947,760 Method for manufacturing an emitter for high-speed heterojunction bipolar transistors
A method for manufacturing a bipolar junction transistor is provided. A layer stack is provided that comprises a semiconductor substrate having a trench...
US-9,947,741 Field-effect semiconductor device having pillar regions of different conductivity type arranged in an active area
In a field-effect semiconductor device, alternating first n-type and p-type pillar regions are arranged in the active area. The first n-type pillar regions are...
US-9,947,648 Semiconductor device including a diode at least partly arranged in a trench
A semiconductor device includes a semiconductor body including a first trench extending into the semiconductor body from a first surface and a diode including...
US-9,947,600 Semiconductor structure having a test structure formed in a group III nitride layer
In an embodiment, a semiconductor structure includes a support substrate comprising a surface adapted to support epitaxial growth of a Group III nitride, one or...
US-9,946,674 Scalable multi-core system-on-chip architecture on multiple dice for high end microcontroller
A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a...
US-9,945,899 Testing of semiconductor devices and devices, and designs thereof
In accordance with an embodiment of the present invention, a method of testing a plurality of semiconductor devices includes applying a stress voltage having a...
US-9,945,884 System and method for a wind speed meter
According to an embodiment, a method of measuring wind speed includes measuring atmospheric pressure at a first pressure sensor arranged inside a case and...
US-9,945,746 Motion detection using pressure sensing
According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure...
US-9,943,228 Functional skin patch
A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit...
US-9,942,677 System and method for a transducer
According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal...
US-9,942,655 Sound processing
Embodiments of the present invention provide a socket that comprises a socket body. The socket body forms a socket cavity for receiving a plug. The socket...
US-9,941,911 Mixing stage, modulator circuit and a current control circuit
A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that...
US-9,941,909 Multiple input and multiple output switch networks
According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch...
US-9,941,908 System and method for a radio frequency filter
In accordance with an embodiment, a circuit includes a plurality of filter circuits having a first port, a second port and a third port, where a second port of...
US-9,941,798 Switched-mode power conversion
In accordance with an embodiment, a method of operating a switched-mode power converter includes defining at least one of a minimum switching frequency...
US-9,941,789 Feedforward circuit for DC-to-DC converters with digital voltage control loop
A method may comprise receiving a first clock signal; receiving a digital duty cycle value; using the first clock signal and digital duty cycle value to...
US-9,941,726 Protection and management of a power supply output shorted to ground
In some examples, a circuit is configured to receive an input signal and deliver, based on the input signal, a charging current to a capacitor. The circuit may...
US-9,941,432 Semiconductor devices, a fluid sensor and a method for forming a semiconductor device
A semiconductor device comprises a plurality of quantum structures comprising predominantly germanium. The plurality of quantum structures are formed on a first...
US-9,941,403 Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device includes a transistor including a source region, a drain region, and a gate electrode. The gate electrode is disposed in a first trench...
US-9,941,402 Semiconductor devices and methods for forming a semiconductor device
A semiconductor device includes a guard structure located laterally between first and second active areas of a semiconductor substrate. The guard structure...
US-9,941,375 Method for manufacturing a semiconductor device having silicide layers
A method for manufacturing a semiconductor device includes providing a semiconductor substrate having a first side. A trench having a bottom is formed. The...
US-9,941,365 Method for forming a stress-reduced field-effect semiconductor device
A method for producing a field-effect semiconductor device includes providing a semiconductor body with a first surface defining a vertical direction, defining...
US-9,941,354 Semiconductor device comprising a first gate trench and a second gate trench
A semiconductor device includes a first gate trench and a second gate trench in a first main surface of a semiconductor substrate. A mesa is arranged between...
US-9,941,349 Superjunction semiconductor device with oppositely doped semiconductor regions formed in trenches
A trench etch mask is formed on a process surface of a semiconductor layer. By using the trench etch mask, both first trenches and second trenches are formed...
US-9,941,276 Method of producing a semiconductor component arrangement comprising a trench transistor
A semiconductor component arrangement method includes producing a trench transistor structure including at least one trench disposed in the semiconductor body...
US-9,941,274 Semiconductor device with a switchable and a non-switchable diode region
A semiconductor device includes at least one IGBT cell region, at least one switchable free-wheeling diode region, and at least one non-switchable free-wheeling...
US-9,941,272 Method of producing a semiconductor device
A semiconductor body has a drift region layer, a body region layer adjoining the drift region layer, and a source region layer adjoining the body region layer...
US-9,941,229 Device including semiconductor chips and method for producing such device
A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a...
US-9,941,193 Semiconductor device package having solder-mounted conductive clip on leadframe
A conductive clip for a semiconductor device package. In one example, the conductive clip may include a number of protrusions that extend from a surface of the...
US-9,941,181 Chip package and method of forming a chip package
In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically...
US-9,941,111 Method for processing a semiconductor layer, method for processing a silicon substrate, and method for...
According to various embodiments, a method for processing a semiconductor layer may include: generating an etch plasma in a plasma chamber of a remote plasma...
US-9,941,000 Memory unit and method of operating a memory unit sector
Disclosed is a memory unit that includes a sector of memory cells. The sector includes a first memory cell configured to selectively take on a state...
US-9,939,410 Transmission of information associated with a possible sensor fault of a magnetic sensor
A magnetic sensor may sense a magnetic field during a rotation of a wheel. The sensed magnetic field may represent a profile of the wheel during the rotation....
US-9,939,331 System and method for a capacitive thermometer
Various embodiments disclosed herein include a capacitive thermometer including a deflectable membrane and a sense electrode. The deflectable membrane is...
US-9,938,141 Semiconductor element and methods for manufacturing the same
A semiconductor element and method are provided such that the method includes providing a processed substrate arrangement including a processed semiconductor...
US-9,938,140 MEMS device and method of manufacturing a MEMS device
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a...
US-9,938,135 Stress decoupled piezoresistive relative pressure sensor and method for manufacturing the same
Embodiments provide a MEMS (Micro Electro Mechanical System) pressure sensor comprising a semiconductor substrate, wherein the semiconductor substrate comprises...
US-9,938,133 System and method for a comb-drive MEMS device
According to an embodiment, a method of forming a MEMS transducer includes forming a transducer frame in a layer of monocrystalline silicon, where forming the...
US-9,936,552 System having a driver with voltage supply using an auxiliary winding of a transformer
In one example, a system includes a controller, a transformer including at least a primary winding and an auxiliary winding, a voltage supply, and a driver. The...
US-9,936,304 Digital silicon microphone with configurable sensitivity, frequency response and noise transfer function
In some embodiments, a microphone system includes a multi-bit delta-sigma modulator configured to be coupled to a microphone and configured to covert an output...
US-9,935,623 Method and apparatus for providing an adjustable high resolution dead time
The disclosure generally relates to a method and an apparatus for providing an adjustable high resolution dead time, and more specifically, to a method and an...
US-9,935,547 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power includes turning on an output switch of the switched-mode power converter coupled...
US-9,935,367 System and method for a beamformer
In accordance with an embodiment a beamforming circuit having a radio frequency (RF) front end and a plurality of beamforming delay circuits coupled to the RF...
US-9,935,259 Hall effect device
A hall effect device includes an active Hall region in a semiconductor substrate, and at least four terminal structures, each terminal structure including a...
US-9,935,126 Method of forming a semiconductor substrate with buried cavities and dielectric support structures
A method of forming a semiconductor device includes forming a plurality of trenches extending into a semiconductor substrate from a first surface of the...
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