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Patent # Description
US-9,998,812 Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording...
A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a...
US-9,998,128 Frequency synthesizer with injection locked oscillator
Representative implementations of devices and techniques provide reduced jitter for a controlled oscillator. An edge of a reference signal is injected at...
US-9,998,110 System and method for variable impedance gate driver
In accordance with an embodiment, a circuit including: a gate driver coupled to a first supply terminal and to an output terminal, the output terminal...
US-9,998,080 Low voltage supply amplifier
A circuit includes a differential input pair stage including bipolar transistors and configured to receive an RF input signal; a cascode stage coupled between...
US-9,998,076 Methods and circuitry to trim common mode transient control circuitry
Embodiments herein include a replica communication path and monitor circuit to provide increased common mode transient immunity. As its name suggests, the...
US-9,998,020 Method and apparatus for efficient switching in semi-resonant power converters
A voltage converter includes a power stage, a passive circuit, a synchronous rectification (SR) switch component, and a control circuit. The passive circuit...
US-9,998,011 Phase current estimation for switching power converters
A phase current estimator for a switching power converter includes analog circuitry for generating a phase current estimate error by comparing a phase current...
US-9,998,008 Active transient response for DC-DC converters
A first power transistor of a DC-DC converter is connected between a voltage supply node and a common node, a second power transistor is connected between a...
US-9,997,608 Transistor device with segmented contact layer
Disclosed is a transistor device. The transistor device includes a plurality of device cells each having an active device region integrated in a semiconductor...
US-9,997,602 Semiconductor device with transistor cells and enhancement cells with delayed control signals
A semiconductor device includes transistor cells and enhancement cells. Each transistor cell includes a body zone that forms a first pn junction with a drift...
US-9,997,595 Semiconductor device, a micro-electro-mechanical resonator and a method for manufacturing a semiconductor device
A semiconductor device includes a silicon substrate layer with a decoupling region. The decoupling region of the silicon substrate layer comprises an array of...
US-9,997,517 Power semiconductor device having fully depleted channel regions
A power semiconductor device is disclosed. In one example, the device includes a semiconductor body coupled to a first load terminal structure and a second load...
US-9,997,515 Semiconductor devices with trench gate structures in a semiconductor body with hexagonal crystal lattice
A semiconductor device includes trench gate structures in a semiconductor body with hexagonal crystal lattice. A mean surface plane of a first surface is tilted...
US-9,997,476 Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
A multi-die package is manufactured by attaching a first semiconductor die made of a first semiconductor material to a thermally conductive flange via a first...
US-9,997,459 Semiconductor device having a barrier layer made of amorphous molybdenum nitride and method for producing such...
A semiconductor device includes a semiconductor body having a front face, a back face and an active zone at the front face. A front surface metallization layer...
US-9,997,443 Through vias and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor chip includes a device region disposed in or over a substrate, a doped region...
US-9,997,359 Semiconductor device with rear-side insert structure
A semiconductor device includes a semiconductor body and a rear side insertion structure. The semiconductor body has a first surface at a front side and a...
US-9,995,793 System and method for a built-in-self-test of a battery
According to an embodiment, a system includes a switching regulator and an electrochemical storage test circuit. The switching regulator is coupled to a power...
US-9,994,179 Circuit arrangements and a method for receiving information
A circuit arrangement is provided, the circuit arrangement including a receiver configured to receive signal information from a sensor circuit; a discharge...
US-9,991,832 Detecting brushfire in power systems
In some examples, a detection circuit is configured to detect a brushfire in a power system based on an electrical signal from the power system. The detection...
US-9,991,806 Voltage converter circuitry and methods implementing modulated feedback signal
Disclosed is a voltage converter and a method. The voltage converter includes: an input, an output, and a transformer including a primary winding and a...
US-9,991,791 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power converter includes measuring an input voltage of the switched-mode power...
US-9,991,609 Electrical connection module, semiconductor module and method for producing a semiconductor module
An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and...
US-9,991,377 Trench FET with ruggedness enhancement regions
According to an exemplary implementation, a field-effect transistor (FET) includes first and second gate trenches extending to a drift region of a first...
US-9,991,373 Semiconductor device
In an embodiment, a semiconductor device includes a substrate, a Group III nitride based transistor arranged on a front surface of the substrate, and a...
US-9,991,347 Semiconductor device having a cavity
A power semiconductor device includes a semiconductor substrate having a drift region, a gate electrode trench in the semiconductor substrate and a field...
US-9,991,340 Mechanical stress-decoupling in semiconductor device
According to a method in semiconductor device fabrication, a first trench and a second trench are concurrently etched in a semi-finished semiconductor device....
US-9,991,252 Semiconductor device comprising electrostatic discharge protection structure
A semiconductor device includes a semiconductor body having first and second opposing surfaces, a first isolation layer on the first surface of the...
US-9,991,183 Semiconductor component having inner and outer semiconductor component housings
A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component...
US-9,989,630 Structured-light based multipath cancellation in ToF imaging
Representative implementations of devices and techniques provide multipath interference cancelling for imaging devices and systems. In various implementations,...
US-9,989,574 System and method for short-circuit detection in load chains
An embodiment method for short-circuit detection includes determining a set of local reference voltages each associated with a respective load chain in a...
US-9,988,262 Temporary mechanical stabilization of semiconductor cavities
A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of...
US-9,987,830 Method for processing a carrier and method for transferring a graphene layer
According to various embodiments, a method for processing a carrier may include: forming a layer structure over the carrier, the layer structure including a...
US-9,986,354 Pre-mold for a microphone assembly and method of producing the same
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially...
US-9,986,344 MEMS microphone with low pressure region between diaphragm and counter electrode
A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter...
US-9,985,639 Detection and mitigation of non-linearity of phase interpolator
Representative implementations of devices and techniques provide non-linearity detection and mitigation for a phase interpolator of a controlled oscillator...
US-9,985,126 Semiconductor device comprising a first gate electrode and a second gate electrode
A semiconductor device includes a transistor. The transistor includes a source region and a drain region disposed adjacent to a first main surface of a...
US-9,985,017 Semiconductor device comprising a clamping structure
Semiconductor device with a semiconductor body that includes a clamping structure including a pn junction diode and a Schottky junction diode serially connected...
US-9,984,930 Method for processing a carrier
A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent...
US-9,984,928 Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Method for producing chip assemblies that include semiconductor chip arrangements, each semiconductor chip arrangement including a semiconductor chip having a...
US-9,984,927 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,984,917 Semiconductor device with an interconnect and a method for manufacturing thereof
A method for manufacturing a semiconductor device in accordance with various embodiments may include: forming an opening in a first region of a semiconductor...
US-9,984,915 Semiconductor wafer and method for processing a semiconductor wafer
According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one...
US-9,984,900 Semiconductor device including at least one element
A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element,...
US-9,984,897 Method for manufacturing a chip arrangement including a ceramic layer
A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the...
US-9,984,691 System for a transducer system with wakeup detection
According to embodiments described herein, a circuit includes an interface circuit configured to be coupled to a transducer and a detection circuit. The...
US-9,982,989 Angle sensors, systems and methods
Embodiments relate to magnetic field angle sensors, including off-axis and on-axis sensors. In an embodiment, a magnetic field angle sensor comprises two sensor...
US-9,981,844 Method of manufacturing semiconductor device with glass pieces
A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material....
US-9,981,843 Chip package and a method of producing the same
A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of...
US-9,979,187 Power device with overvoltage arrester
An example power device includes a semiconductor chip and an arrester element configurable to, in response to a voltage across the arrester element being...
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