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| Patent # | Description |
|---|---|
| US-1,044,0825 |
Chip card module and method for producing a chip card module In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged... |
| US-1,044,0786 |
Control circuit and techniques for controlling a LED array Devices and techniques for individual control of multiple light emitting diodes (LEDs) in a LED array. A LED array may include multiple strands of LEDs with... |
| US-1,043,9629 |
Method and device for signal converting In accordance with an embodiment, a method includes adding a dither signal to a first signal to generate a second signal, subtracting the dither signal from the... |
| US-1,043,9500 |
Control of isolated power converters during transient load conditions An isolated power converter includes primary side switch devices coupled to secondary side rectifying devices by a transformer and a controller. Responsive to a... |
| US-1,043,9487 |
Voltage converter circuit and method for operating a voltage converter
circuit Converter devices and methods are disclosed. A supply voltage (Vcc), for example to supply a control circuit (11) controlling a switch (Q1), is generated using... |
| US-1,043,9062 |
Metallization layers for semiconductor devices and methods of forming
thereof A method of fabricating a semiconductor device includes etching a first surface of a semiconductor substrate from a first side using a first etching process to... |
| US-1,043,9055 |
IGBT with dV/dt controllability An IGBT having a barrier region is presented. A power unit cell of the IGBT has at least two trenches that may both extend into the barrier region. The barrier... |
| US-1,043,9030 |
Semiconductor device having a channel region patterned into a ridge by
adjacent gate trenches A semiconductor device includes a transistor in a semiconductor body having a first main surface. The transistor includes: a source contact electrically... |
| US-1,043,9025 |
Method for producing a semiconductor body having a recombination zone,
semiconductor component having a... A first part of a semiconductor body is provided. Impurities are introduced into the first part of the semiconductor body, The impurities act as recombination... |
| US-1,043,8945 |
Method of manufacturing a semiconductor die A method of manufacturing a semiconductor die includes: forming a power HEMT (high-electron-mobility transistor) in a III-nitride semiconductor substrate, the... |
| US-1,043,8903 |
Crack stop barrier and method of manufacturing thereof A semiconductor device includes a chip, a first kerf adjacent the chip and having a first main direction, a second kerf adjacent the chip and having a second... |
| US-1,043,8878 |
Package with component connected with carrier via spacer particles A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component... |
| US-1,043,8876 |
Power quad flat no-lead (PQFN) package in a single shunt inverter circuit According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a driver integrated circuit (IC) situated on a leadframe. The PQFN... |
| US-1,043,8870 |
Semiconductor device packaging assembly, lead frame strip and unit lead
frame with molding compound channels A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery... |
| US-1,043,8835 |
System reference with compensation of electrical and mechanical stress and
life-time drift effects Stress compensated systems and methods of compensating for electrical and mechanical stress are discussed. One example system can include a first circuit and a... |
| US-1,043,8680 |
Non-volatile memory testing Devices, systems and methods are provided which comprise testing of a non-volatile memory concurrently during at least a part of a testing of other system parts... |
| US-1,043,7989 |
Secure signal transmission A processing device having a skew controller configured to measure skew values between a plurality of signal lines coupled to the processing device; and a... |
| US-1,043,6852 |
Battery monitoring using a redundant neighbor measurement In one example, a circuit includes a first integrated circuit and a second integrated circuit. The first integrated circuit is configured to detect a first... |
| US-1,043,6605 |
Apparatus and method for distinguishing data of a plurality of
multidimensional magnetic field sensors Embodiments relate to apparatus (200) and methods for distinguishing data of a plurality of multidimensional magnetic field sensors (120). A first sensor... |
| US-1,043,5292 |
Method for producing a semiconductor module The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps,... |
| US-1,043,3736 |
Implantable vessel fluid sensor An implantable vessel fluid sensor is configured to sense at least one vessel fluid parameter of a vessel. The implantable vessel fluid sensor includes a... |
| US-1,043,3378 |
Power converter control using calculated average current A controller circuit is configured to drive a switching element to establish a channel that electrically couples a source to an inductive element of a buck... |
| US-1,043,3070 |
Sensitivity compensation for capacitive MEMS device A MEMS device includes a membrane and a counter electrode structure spaced apart from the membrane. The counter electrode structure includes a non-planar... |
| US-1,043,2097 |
Selection control for transformer winding input in a power converter Circuits and methods are provided for supplying power to a transformer of a switching DC/DC voltage converter within a power converter. The power converter... |
| US-1,043,1708 |
Integrated circuit including ESD device and radiation emitting device An integrated circuit including ESD device is disclosed. One embodiment includes a semiconductor region being electrically isolated from adjacent semiconductor... |
| US-1,043,1698 |
Semiconductor device with non-ohmic contact between SiC and a contact
layer containing metal nitride According to an embodiment of a semiconductor device, the semiconductor device includes a contact layer in contact with SiC material. The contact layer includes... |
| US-1,043,1681 |
Semiconductor devices and a method for forming a semiconductor device A semiconductor device includes a gate trench of at least one transistor structure extending into a semiconductor substrate. The gate trench includes at least... |
| US-1,043,1560 |
Molded semiconductor package having an optical inspection feature A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main... |
| US-1,043,1504 |
Method of manufacturing semiconductor devices by bonding a semiconductor
disk on a base substrate, composite... A semiconductor disk of a first crystalline material, which has a first lattice system, is bonded on a process surface of a base substrate, wherein a bonding... |
| US-1,043,1471 |
Method of planarizing a semiconductor wafer and semiconductor wafer Various embodiments provide a method of planarizing a semiconductor wafer, wherein the method comprises providing a semiconductor wafer comprising a surface;... |
| US-1,042,6028 |
Printed circuit board with insulated metal substrate made of steel A power electronic device includes an Insulated Metal Substrate Printed Circuit Board (IMS PCB) and a power semiconductor device package. The power... |
| US-1,042,5067 |
Memory device and method for operating a memory device Devices are provided in which a metastable state can be detected in a memory device by means of a metastability detector. Corresponding information can be... |
| US-1,042,5017 |
Method and apparatus for reducing current sensor power loss A space vector PWM technique includes defining a target voltage vector located in a sector defined by two switching voltage vectors, applying one switching... |
| US-1,042,5007 |
Multiphase regulator with phase current testing According to an embodiment, a multiphase regulator includes a plurality of output phases each of which is operable to deliver a phase current through a separate... |
| US-1,042,5006 |
Dynamic voltage transition control methods for switched mode power
converters A method of controlling a voltage regulator includes regulating a voltage output by the voltage regulator to correspond to a target voltage, generating a... |
| US-1,042,4819 |
Semiconductor battery and semiconductor device including a semiconductor
battery A semiconductor battery includes a substrate, a battery anode semiconductor material arranged in or over the substrate, a battery cathode material arranged in... |
| US-1,042,4645 |
Semiconductor device, method for testing a semiconductor device and method
for forming a semiconductor device A semiconductor device includes a first source wiring substructure connected to a plurality of source doping region portions of a transistor structure, and a... |
| US-1,042,4636 |
Power semiconductor devices, semiconductor devices and a method for
adjusting a number of charge carriers A power semiconductor device includes a semiconductor substrate including at least one electrical structure. The at least one electrical structure has a... |
| US-1,042,4534 |
Semiconductor device including a clip A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a... |
| US-1,042,3870 |
Communication module Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured... |
| US-1,042,2662 |
Magnetic field sensor and magnetic field sensing method A magnetic field sensor is disclosed that includes at least one magneto-resistive spin-valve sensor element configured to sense a first magnetic field component... |
| US-1,042,1665 |
Process for the formation of a graphene membrane component, graphene
membrane component, microphone and... A process for the formation of a graphene membrane component includes arranging a graphene membrane in a relaxed condition of the graphene membrane on a surface... |
| US-1,042,0178 |
Light emitting diode driver for load and supply changes In one example, a system includes a load module, a power module, a series module, and a control module. The power module is configured to generate a supply... |
| US-1,041,9251 |
Digital signal transfer using integrated transformers with electrical
isolation An isolator includes a transmitter, a coupling module and a receiver. The transmitter drives an input of the coupling module in response to a digital signal,... |
| US-1,041,8999 |
Programmable logic circuit and method for implementing a boolean function According to an embodiment, a programmable logic circuit is described comprising a first data bit input to receive a first data bit a and a second data bit... |
| US-1,041,8996 |
Circuit and method for checking the integrity of a control signal According to an embodiment, a circuit is described comprising a plurality of flip-flops, a control circuit configured to provide a control signal to each... |
| US-1,041,8984 |
Switch A switch includes an input terminal, an output terminal, and a stack including transistors, such as, for example, field effect transistors, coupled in series,... |
| US-1,041,8452 |
Semiconductor device with different gate trenches A semiconductor device includes a first trench and a second trench in a first main surface of a semiconductor substrate. Each of the first and second trenches... |
| US-1,041,8358 |
Semiconductor device having an electrostatic discharge protection
structure A semiconductor device includes a semiconductor body having a first surface and a second surface opposite to the first surface. A first isolation layer is... |
| US-1,041,8343 |
Package-in-package structure for semiconductor devices and methods of
manufacture A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality... |
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